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CORC

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Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method 期刊论文
IEEE ACCESS, 2019, 卷号: 7, 页码: 68495-68502
作者:  Chen, Wei;  Fan, Jiajie;  Qian, Cheng;  Pu, Bin;  Fan, Xuejun
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Thermal Management on IGBT Power Electronic Devices and Modules 期刊论文
2018, 卷号: 6, 页码: 12868-12884
作者:  Qian, Cheng[1];  Gheitaghy, Amir Mirza[2];  Fan, Jiajie[3,4];  Tang, Hongyu[2,4];  Sun, Bo[2,4]
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/30
Thermal Management on IGBT Power Electronic Devices and Modules 期刊论文
IEEE ACCESS, 2018, 卷号: 6, 页码: 12868-12884
作者:  Qian, Cheng;  Gheitaghy, Amir Mirza;  Fan, Jiajie;  Tang, Hongyu;  Sun, Bo
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/30
Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1254-1262
作者:  Jiang, Chengshuo;  Fan, Jiajie;  Qian, Cheng;  Zhang, Hao;  Fan, Xuejun
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures 期刊论文
MICROELECTRONICS RELIABILITY, 2018, 卷号: 84, 页码: 140-148
作者:  Fan, Jiajie;  Cao, Jianwu;  Yu, Chaohua;  Qian, Cheng;  Fan, Xuejun
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/30
Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Wang, Zhen;  Fan, Jiajie;  Liu, Jie;  Hu, Aihua;  Qian, Cheng
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
A design and qualification of LED flip Chip-on-Board module with tunable color temperatures 会议论文
MICROELECTRONICS RELIABILITY, 2018-05-01
作者:  Fan, Jiajie;  Cao, Jianwu;  Yu, Chaohua;  Qian, Cheng;  Fan, Xuejun
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation 期刊论文
2017, 卷号: 163, 页码: 14-21
作者:  Sun, Bo[1,2];  Fan, Xuejun[2,3];  Ye, Huaiyu[4];  Fan, Jiajie[2,5];  Qian, Cheng[2,6]
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/30
Photometric and Colorimetric Assessment of LED Chip Scale Packages by Using a Step-Stress Accelerated Degradation Test (SSADT) Method 期刊论文
MATERIALS, 2017, 卷号: 10
作者:  Qian, Cheng;  Fan, Jiajie;  Fang, Jiayi;  Yu, Chaohua;  Ren, Yi
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
PoF-Simulation-Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers 期刊论文
ieee transactions on industrial electronics, 2016, 卷号: 63, 期号: 11, 页码: 6726-6735
Bo Sun; Xuejun Fan; Cheng Qian; Guoqi Zhang
收藏  |  浏览/下载：18/0  |  提交时间：2017/03/16

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