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	Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method
	Chen, Wei; Fan, Jiajie; Qian, Cheng; Pu, Bin; Fan, Xuejun; Zhang, Guoqi
刊名	IEEE ACCESS
	2019
卷号	7页码:68495-68502
关键词	Light-emitting diode luminous flux response surface model spectral power distribution luminous efficacy decay degradation mechanism
ISSN号	2169-3536
DOI	10.1109/ACCESS.2019.2916878
URL标识	查看原文
收录类别	SCIE ; EI
WOS记录号	WOS:000471224200001
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/5919129
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Chen, Wei,Fan, Jiajie,Qian, Cheng,et al. Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method[J]. IEEE ACCESS,2019,7:68495-68502.
APA	Chen, Wei,Fan, Jiajie,Qian, Cheng,Pu, Bin,Fan, Xuejun,&Zhang, Guoqi.(2019).Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method.IEEE ACCESS,7,68495-68502.
MLA	Chen, Wei,et al."Reliability Assessment of Light-Emitting Diode Packages With Both Luminous Flux Response Surface Model and Spectral Power Distribution Method".IEEE ACCESS 7(2019):68495-68502.

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