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| A parallel mechanism underlying frizzle in domestic chickens 期刊论文 2018, 卷号: 10, 期号: 6, 页码: 589 作者: Guo, Xing[1,2]; Li, Yan-Qing[3]; Wang, Ming-Shan[1,2]; Wang, Zhi-Bin[3]; Zhang, Quan[3]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:8/0  |  提交时间:2019/12/26 |
| A new secondary metabolite from the fermented mycelia of Streptomyces antibiotic H41-55. 期刊论文 2017 作者: Li, Xian-Sheng[5]; Zheng, Xin-Heng[5]; Chen, Fang[5]; Lin, Bi-Run[4]; Zhou, Guang-Xiong[5]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:2/0  |  提交时间:2019/12/17 |
| IP core design of PLC microprocessor with boolean module 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者: Xu, Mei-Hua[1]; Ran, Feng[2]; Chen, Zhang-Jin[3]; Kang, Shu-Feng[4]; Li, Run-Guang[5]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:2/0  |  提交时间:2019/05/10 |
| IP Core design of PLC microprocessor with Boolean module 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者: Xu Mei-hua[1]; Ran Feng[2]; Chen Zhang-jin[3]; Kang Shu-feng[4]; Li Run-guang[5]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:2/0  |  提交时间:2019/05/10 |
| IP Core design of PLC microprocessor with Boolean module 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者: Xu Mei-hua[1]; Ran Feng[2]; Chen Zhang-jin[3]; Kang Shu-feng[4]; Li Run-guang[5]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:3/0  |  提交时间:2019/05/10 |
| IP Core design of PLC microprocessor with Boolean module 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者: Xu Mei-hua[1]; Ran Feng[2]; Chen Zhang-jin[3]; Kang Shu-feng[4]; Li Run-guang[5]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:2/0  |  提交时间:2019/05/10 |
| IP Core design of PLC microprocessor with Boolean module 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者: Xu Mei-hua[1]; Ran Feng[2]; Chen Zhang-jin[3]; Kang Shu-feng[4]; Li Run-guang[5]
![](/themes/default/image/downing1.png) 收藏  |  浏览/下载:5/0  |  提交时间:2019/05/10 |