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浏览/检索结果: 共10条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Experimental Investigation and Micropolar Modelling of the Anisotropic Conductive Adhesive Flip-Chip Interconnection 期刊论文 JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2008, 卷号: 22, 页码: 1717-1731 作者:  Zhang, Yan[1];  Liu, Johan[2];  Larsson, Ragnar[3];  Watanabe, Itsuo[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/06 ACF  micropolar model  interconnect  interferometry   Experimental and modeling of the stress-strain behavior of a BGA interconnect due to thermal load 期刊论文 JOURNAL OF ELECTRONIC PACKAGING, 2008, 卷号: 130, 页码: 0210101-0210107 作者:  Zhang, Yan[1];  Liu, Johan[2];  Larsson, Ragnar[3] 收藏  |  浏览/下载：7/0  |  提交时间：2019/05/06 interconnect  interface  interferometer  micropolar theory   Study on the multi-scale properties of the internal structure in ACA interconnection 会议论文 ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05 作者:  Zhang, Yan[1];  Larsson, Ragnar[2];  Fan, Jing-Yu[3];  Liu, Johan[4] 收藏  |  浏览/下载：7/0  |  提交时间：2019/05/10 Second order multi-scale micropolar model for microsystem interconnections 会议论文 PROCEEDINGS OF THE 5TH INTERNATIONAL CONFERENCE ON NONLINEAR MECHANICS 作者:  Zhang, Yan[1];  Liu, Johan[2];  Fan, Jing-Yu[3];  Larsson, Ragnar[4] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 Interface modelling of microsystem interconnections using micropolar theory and discontinuous approximation 期刊论文 COMPUTERS & STRUCTURES, 2007, 卷号: 85, 页码: 1500-1513 作者:  Zhang, Yan[1];  Larsson, Ragnar[2];  Fan, Jing-yu[3];  Liu, Johan[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 microsystem  micropolar  interconnect  interface  discontinuous approximation  regularization   Homogenization of microsystem interconnects based on micropolar theory and discontinuous kinematics 期刊论文 JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS, 2007, 卷号: 55, 页码: 819-841 作者:  Larsson, Ragnar[1];  Zhang, Yan[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 micropolar theory  adhesive interfaces  discontinuous approximation  homogenization  second gradient theory   Interface modelling of ACA interconnects using micropolar theory 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Zhang, Yan[1];  Larsson, Ragnar[2];  Fan, Jing-Yu[3];  Liu, Johan[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Homogenization model based on micropolar theory for the interconnection layer in microsystem packaging 会议论文 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006-06-27 作者:  Zhang, Yan[1];  Larsson, Ragnar[2];  Fan, Jing-yu[3];  Cheng, Zhaonian[4];  Liu, Johan[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 Study on the multi-scale properties of the internal structure in ACA interconnection 会议论文 ESTC 2006: 1st Electronics Systemintegration Technology Conference, Vols 1 and 2, Proceedings 作者:  Zhang, Yan[1];  Larsson, Ragnar[2];  Fan, Jing-yu[3];  Liu, Johan[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/05/10 Microsystem interconnections modelling using micropolar theory and discontinuous approximation 会议论文 Polytronic 2005: 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2005-10-23 作者:  Zhang, Yan[1];  Larsson, Ragnar[2];  Fan, Jingyu[3];  Cheng, Zhaonian[4];  Liu, Johan[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10