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	Homogenization model based on micropolar theory for the interconnection layer in microsystem packaging
	Zhang, Yan[1]; Larsson, Ragnar[2]; Fan, Jing-yu[3]; Cheng, Zhaonian[4]; Liu, Johan[5]
	2006
会议名称	2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06
会议日期	2006-06-27
页码	115-119
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2391375
专题	上海大学
作者单位	1.Key Laboratory of Advanced Display and System Applications, Shanghai University, Ministry of Education, Shanghai 200072, China 2.Department of Applied Mechanics, Chalmers University of Technology, Se-412 96 Gothenburg, Sweden 3.Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Shanghai 200072, China 4.SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Se-412 96 Gothenburg, Sweden
推荐引用方式 GB/T 7714	Zhang, Yan[1],Larsson, Ragnar[2],Fan, Jing-yu[3],et al. Homogenization model based on micropolar theory for the interconnection layer in microsystem packaging[C]. 见:2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. 2006-06-27.

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