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浏览/检索结果: 共11条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序作者升序作者降序提交时间升序提交时间降序题名升序题名降序 One-step synthesis of hollow nanostructured aniline oligomers and their derived nitrogen doped carbon 期刊论文 2017, 卷号: 227, 页码: 170-176 作者:  Xing, Shuangxi[1];  Chen, Lin[1];  Huang, Lei[1];  Wang, Tian[2];  Yu, Xiaodan[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/11/30 miR-1827 inhibits osteogenic differentiation by targeting IGF1 in MSMSCs 期刊论文 SCIENTIFIC REPORTS, 2017, 卷号: 7, 页码: 000-000 作者:  Zhu, ShuangXi[1,2];  Peng, Wei[1,2];  Li, Xiang[1,2];  Weng, JunQuan[1,2];  Zhang, Xing[3] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24 Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders 会议论文 29th IEEE International Conference on Microelectronic Test Structures (ICMTS) 作者:  Jeppson, Kjell[1];  Bao, Jie[2];  Huang, Shirong[3];  Zhang, Yong[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：19/0  |  提交时间：2019/04/26 test structure  resistance temperature detectors  hotspots  heat spreaders  graphene  boron nitride   Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review 会议论文 6th Electronic System-Integration Technology Conference (ESTC) 作者:  Fu, Yifeng[1];  Mu, Wei[2];  Sun, Shuangxi[3];  Wang, Ning[4];  Huang, Shirong[5] 收藏  |  浏览/下载：22/0  |  提交时间：2019/04/26 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders 会议论文 29th IEEE International Conference on Microelectronic Test Structures, ICMTS 2016, 2016-03-28 作者:  Jeppson, Kjell[1];  Bao, Jie[2];  Huang, Shirong[3];  Zhang, Yong[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26 Thermal properties of TIM using CNTs forest in electronics packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Zhang, Dongsheng[1] 收藏  |  浏览/下载：12/0  |  提交时间：2019/04/26 VACNT  heat  dissipation  hotspot  thermal test chip  resistance temperature detector   Graphene Based Heat Spreader for High Power Chip Cooling Using Flip-chip Technology 会议论文 Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC), 2013-12-11 作者:  Huang, Shirong[1];  Zhang, Yong[2];  Sun, Shuangxi[3];  Fan, Xiaogang[4];  Wang, Ling[5] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/30 Characterization for Graphene as Heat Spreader Using Thermal Imaging Method 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013-08-11 作者:  Huang, Shirong[1];  Zhang, Yong[2];  Sun, Shuangxi[3];  Fan, Xiaogang[4];  Wang, Ling[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Quantitative Chemical Indices of Weathered Igneous Rocks 期刊论文 2001, 卷号: 28, 期号: z1 作者:  Chan Lung Sang;  CHEN Q.Margie1;  HUANG Runqiu;  ZHANG Shuangxi;  TAM K.Janice 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09