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浏览/检索结果: 共12条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Emission factors and environmental implication of organic pollutants in PM emitted from various vessels in China 期刊论文 ATMOSPHERIC ENVIRONMENT, 2019, 卷号: 200, 页码: 302-311 作者:  Zhang, Fan[1];  Chen, Yingjun[2];  Cui, Min[3];  Feng, Yanli[4];  Yang, Xin[5] 收藏  |  浏览/下载：20/0  |  提交时间：2019/04/22 Emission factor  Organic pollutants  PM  Vessel  Environmental implication   Large Increases in Primary Trimethylaminium and Secondary Dimethylaminium in Atmospheric Particles Associated With Cyclonic Eddies in the Northwest Pacific Ocean 期刊论文 JOURNAL OF GEOPHYSICAL RESEARCH-ATMOSPHERES, 2018, 卷号: 123, 期号: 21, 页码: 12133-12146 作者:  Hu, Qingjing[1];  Qu, Keming[2];  Gao, Huiwang[3];  Cui, Zhengguo[4];  Gao, Yang[5] 收藏  |  浏览/下载：6/0  |  提交时间：2020/01/02 A New Thermally Conductive Thermoplastic Die Attach Film 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012-08-13 作者:  Duan, Yajun[1];  Ye, Lilei[2];  Cui, Huiwang[3];  Liu, Johan[4] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/30 A Highly Conductive Bimodal Isotropic Conductive Adhesive and Its Reliability 会议论文 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13 作者:  Li, Dongsheng[1];  Cui, Huiwang[2];  Chen, Si[3];  Fan, Qiong[4];  Yuan, Zhichao[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives 会议论文 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13 作者:  Fan, Qiong[1];  Cui, Huiwang[2];  Fu, Chune[3];  Li, Dongsheng[4];  Tang, Xin[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Study on the Reliability of Fast Curing Isotropic Conductive Adhesive 会议论文 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011-03-13 作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/30 Study into High Temperature Reliability of Isotropic Conductive Adhesive 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08 作者:  Du, Wenhui[1];  Cui, Huiwang[2];  Chen, Si[3];  Yuan, Zhichao[4];  Ye, Lilei[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30 Study into the Application of Single-Wall Carbon Nanotubes in Isotropic Conductive Adhesives 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08 作者:  Li, Dongsheng[1];  Cui, Huiwang[2];  Fan, Qiong[3];  Duan, Yajun[4];  Yuan, Zhichao[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/30 SCNTs  ICAs  mechanical properties  electrical properties  thermal and humid properties   The Effect of Functionalized Silver on Properties of Conductive Adhesives 会议论文 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011-08-08 作者:  Fan, Qiong[1];  Cui, Huiwang[2];  Li, Dongsheng[3];  Hu, Zhili[4];  Yuan, Zhichao[5] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30 Effects of BN and SiC Nanoparticles on Properties of Conductive Adhesive 会议论文 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010-08-16 作者:  Lai, Huaxiang[1];  Lu, Xiuzhen[2];  Cui, Huiwang[3];  Liu, Xiaohua[4];  Chen, Si[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30