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CORC

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Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach 期刊论文
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2010, 卷号: 16, 页码: 633-639
作者:  Yue, Cong[1];  Zhang, Yan[2];  Hu, Zhili[3];  Liu, Johan[4];  Cheng, Zhaonian[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
FEM Simulation of Bimodal and Trimodal Thermally Conductive Adhesives 会议论文
9th IEEE Conference on Nanotechnology (IEEE-NANO), 2009-07-26
作者:  Nabiollahi, Nabi[1];  Liu, Johan[2];  Zhu Hilli[3];  Zhang, Yan[4];  Cong, Yue[5]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/30
The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu-0.4Co eutectic solder and ENIG/Cu substrate finish 会议论文
ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS
作者:  Zhang, Lili[1];  Andersson, Cristina[2];  Liu, Johan[3];  Cheng, Zhaonian[4]
收藏  |  浏览/下载：2/0  |  提交时间：2019/05/06
The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu-0.4Co eutectic solder and ENIG/Cu substrate finish 会议论文
ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008-09-01
作者:  Zhang, Lili[1];  Andersson, Cristina[2];  Liu, Johan[3];  Cheng, Zhaonian[4]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06
Numerical Investigation on the Effect of Filler Distribution on Effective Thermal Conductivity of Thermal Interface Material 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者:  Yue, Cong[1];  Zhang, Yan[2];  Liu, Johan[3];  Cheng, Zhaonian[4];  Fan, Jing-yu[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06
Manufacture, Microstructure and Microhardness Analysis of Sn-Bi Lead-Free Solder Reinforced with Sn-Ag-Cu Nano-particles 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者:  Zhang, Lili[1];  Tao, Wenkai[2];  Liu, Johan[3];  Zhang, Yan[4];  Cheng, Zhaonian[5]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06
A Study of Fluid Coolant with Carbon Nanotube Suspension for Microchannel Coolers 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者:  Fan, Yi[1];  Fu, Yifeng[2];  Zhang, Yan[3];  Wang, Teng[4];  Wang, Xiaojing[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/05/06
Nano-Thermal Interface Material with CNT Nano-Particles For Heat Dissipation Application 会议论文
2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008-07-28
作者:  Xu, Li[1];  Yue, Cong[2];  Liu, Johan[3];  Zhang, Yan[4];  Lu, Xiu Zhen[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/05/06
The effect of reflow temperature and time on the formation and growth kinetics of Intermetallic Compounds (IMCs) between Sn-0.7Cu-0.4Co eutectic solder and ENIG/Cu substrate finish 会议论文
ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS
作者:  Zhang, Lili[1];  Andersson, Cristina[2];  Liu, Johan[3];  Cheng, Zhaonian[4]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/06
Heat Removal of Microchannel Coolers with Carbon Nanotube Suspension as the Coolant 会议论文
ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008-09-01
作者:  Fan, Yi[1];  Fu, Yifeng[2];  Wang, Teng[3];  Liu, Johan[4];  Zhang, Yan[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/05/06

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