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CORC

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Bumping UBM metal residue defect analysis and improvement using techniques of design of experiment (DOE) 会议论文
2nd IEEE Information Technology, Networking, Electronic and Automation Control Conference, ITNEC 2017, 2017-12-15
作者:  Chen, Lin[1];  Chen, Chee-Cheng[2]
收藏  |  浏览/下载：7/0  |  提交时间：2019/04/22
Bumping UBM Metal Residue Defect Analysis and Improvement Using Techniques of Design of Experiment (DOE) 会议论文
PROCEEDINGS OF 2017 IEEE 2ND INFORMATION TECHNOLOGY, NETWORKING, ELECTRONIC AND AUTOMATION CONTROL CONFERENCE (ITNEC), 2017-01-01
作者:  Chen, Lin[1];  Chen, Chee-Cheng[2]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/24
Optimizing Process Conditions Using Design of Experiments - A Wire Bonding, Semiconductor Assembly Process Case Study 会议论文
2015 12th International Conference on Service Systems and Service Management (ICSSSM), 2015-01-01
作者:  Wang, Xiaoying[1];  Chen, Chee-Cheng[2]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26
Applying quality function deployment techniques in lead production project selection and assignment 会议论文
作者:  Chen, Chee Cheng[1];  Zhang, Qing[2]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30
A COPQ-based VOC and core-process analysis 会议论文
International Asia Conference on Industrial Engineering and Management Innovation: Core Areas of Industrial Engineering, IEMI 2012, 2012-08-10
作者:  Chen, Chee-Cheng[1];  Zhao, Shuo[2]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30
A FMEA-Aided Equipment Life-Cycle-Cost Measurement System 会议论文
PROCEEDINGS OF 2012 3RD INTERNATIONAL ASIA CONFERENCE ON INDUSTRIAL ENGINEERING AND MANAGEMENT INNOVATION (IEMI2012), 2012-08-10
作者:  Chen, Chee-cheng[1];  Zhang, Hong[2]
收藏  |  浏览/下载：1/0  |  提交时间：2019/04/30
Application of quality function deployment in the semiconductor industry: A case study 期刊论文
COMPUTERS & INDUSTRIAL ENGINEERING, 2010, 卷号: 58, 页码: 672-679
作者:  Chen, Chee-Cheng[1]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30

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