| Bumping UBM Metal Residue Defect Analysis and Improvement Using Techniques of Design of Experiment (DOE) | |
| Chen, Lin[1]; Chen, Chee-Cheng[2] | |
| 2017 | |
| 会议名称 | PROCEEDINGS OF 2017 IEEE 2ND INFORMATION TECHNOLOGY, NETWORKING, ELECTRONIC AND AUTOMATION CONTROL CONFERENCE (ITNEC) |
| 会议日期 | 2017-01-01 |
| 关键词 | design of experiment bumping UBM metal residue the semiconductor company |
| 页码 | 1751-1755 |
| URL标识 | 查看原文 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2196696 |
| 专题 | 上海大学 |
| 作者单位 | 1.[1]Shanghai Univ, Management Sci & Engn, Shanghai, Peoples R China. 2.[2]Shanghai Univ, Management Sci & Engn, Shanghai, Peoples R China. |
| 推荐引用方式 GB/T 7714 | Chen, Lin[1],Chen, Chee-Cheng[2]. Bumping UBM Metal Residue Defect Analysis and Improvement Using Techniques of Design of Experiment (DOE)[C]. 见:PROCEEDINGS OF 2017 IEEE 2ND INFORMATION TECHNOLOGY, NETWORKING, ELECTRONIC AND AUTOMATION CONTROL CONFERENCE (ITNEC). 2017-01-01. |
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