×
验证码:
换一张
忘记密码?
记住我
CORC
首页
科研机构
检索
知识图谱
申请加入
托管服务
登录
注册
在结果中检索
科研机构
武汉轻工大学 [8]
近代物理研究所 [7]
北京航空航天大学 [6]
安徽大学 [3]
河北大学 [3]
武汉大学 [3]
更多...
内容类型
期刊论文 [21]
会议论文 [11]
专利 [4]
发表日期
2019 [2]
2018 [2]
2017 [4]
2016 [2]
2015 [3]
2014 [5]
更多...
学科主题
Biochemist... [1]
纳米科技与材料物理 [1]
×
知识图谱
CORC
开始提交
已提交作品
待认领作品
已认领作品
未提交全文
收藏管理
QQ客服
官方微博
反馈留言
浏览/检索结果:
共36条,第1-10条
帮助
已选(
0
)
清除
条数/页:
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
95
100
排序方式:
请选择
发表日期升序
发表日期降序
作者升序
作者降序
提交时间升序
提交时间降序
题名升序
题名降序
A New Model for Deriving the Priority Weights from Hesitant Triangular Fuzzy Preference Relations
期刊论文
Mathematical Problems in Engineering, 2019, 卷号: 2019, 期号: 1, 页码: 1-12
作者:
Liu, Yuan
;
Shen, Gongtian*
;
Zhao, Zhangyan
;
Wu, Zhanwen
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/04
A new model for deriving the priority weights from hesitant triangular fuzzy preference relations (Open Access)
期刊论文
Mathematical Problems in Engineering, 2019, 卷号: 2019
作者:
Liu, Yuan
;
Shen, Gongtian
;
Zhao, Zhangyan
;
Wu, Zhanwen
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/05
Effect of eddy current inducted heating on optical property and thermostability of high power LED
期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 819-822
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Proformance Thermal Fatigue
Reliability
Effect of rapid inducted heating on the microstructure of solder joint in IC
会议论文
19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/27
lead-free joint
rapid thermal cycling
microstructure
IMC
electronic packaging
Phase engineering of cobalt hydroxides using magnetic fields for enhanced supercapacitor performance
期刊论文
JOURNAL OF MATERIALS CHEMISTRY A, 2017, 卷号: 5, 期号: 36, 页码: 19203-19209
作者:
Dai, Peng
;
Yan, Taotao
;
Hu, Lin
;
Pang, Zhanwen
;
Bao, Zhiwei
收藏
  |  
浏览/下载:24/0
  |  
提交时间:2018/08/16
Phase engineering of cobalt hydroxides using magnetic fields for enhanced supercapacitor performance
期刊论文
JOURNAL OF MATERIALS CHEMISTRY A, 2017, 卷号: 5, 期号: 36, 页码: 19203-19209
作者:
Peng Dai
;
Taotao Yan
;
Lin Hu
;
Zhanwen Pang
;
Zhiwei Bao
收藏
  |  
浏览/下载:19/0
  |  
提交时间:2018/10/18
Research on microstructures of double interfaces SAC305 solder joint by RPC
会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/27
lead-free joint
rapid thermal cycling
microstructure
IMC
electronic packaging
Performances and microstructures of a high-power LED based on rapid thermal cycling
会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Proformance Thermal Fatigue
Reliability
A comparative study of properties and microstructures on thermal fatigue testing of a High-power LED
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Property
Thermal Fatigue
Reliability
Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016
作者:
Chen, Jibing*
;
Wan, Nang
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/27
lead-free joint
rapid thermal cycle
solder joint
microstructure
IMC
electronic packaging
©版权所有 ©2017 CSpace - Powered by
CSpace