Research on microstructures of double interfaces SAC305 solder joint by RPC | |
Chen, Jibing*; Wan, Nong; Li, Juying; He, Zhanwen; Wu, Yiping | |
2017 | |
会议名称 | 18th International Conference on Electronic Packaging Technology (ICEPT) |
会议日期 | AUG 16-19, 2017 |
会议地点 | IEEE, Harbin, PEOPLES R CHINA |
关键词 | lead-free joint rapid thermal cycling microstructure IMC electronic packaging |
页码 | 301-304 |
会议录 | 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) |
URL标识 | 查看原文 |
WOS记录号 | WOS:000431392000066 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5582571 |
专题 | 武汉轻工大学 |
作者单位 | 1.[Wan, Nong 2.He, Zhanwen 3.Chen, Jibing 4.Li, Juying] Wuhan Polytech Univ, Sch Mech Engn, Wuhan, Hubei, Peoples R China. |
推荐引用方式 GB/T 7714 | Chen, Jibing*,Wan, Nong,Li, Juying,et al. Research on microstructures of double interfaces SAC305 solder joint by RPC[C]. 见:18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, Harbin, PEOPLES R CHINA. AUG 16-19, 2017. |
个性服务 |
查看访问统计 |
相关权益政策 |
暂无数据 |
收藏/分享 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论