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浏览/检索结果: 共36条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Design and implementation of a 700–2,600 MHz RF SiP module for micro base station 期刊论文 MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2014 作者:  Cao LQ(曹立强);  He Y(何毅);  Liu FM(刘丰满);  Hou FZ(侯峰泽);  Wu P(吴鹏) 收藏  |  浏览/下载：10/0  |  提交时间：2015/04/22 Nanostructured polymer-metal composite for thermal interface material applications 会议论文 58th Electronic Components and Technology Conference, 2008-05-27 作者:  Carlberg, Bj?rn[1];  Wang, Teng[2];  Fu, Yifeng[3];  Liu, Johan[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/06 Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal cycling testing 会议论文 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, 2006-08-26 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Liu, Johan[3];  Andersson, Dag R.[4];  Tegehall, Per-Erik[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 New nano-thermal interface material for heat removal in electronics packaging 会议论文 ESTC 2006 - 1st Electronics Systemintegration Technology Conference, 2006-09-05 作者:  Liu, Johan[1];  Olorunyomi, Michael Olugbenga[2];  Lu, Xiuzhen[3];  Wang, WenXuan[4];  Aronsson, Tomas[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Investigation of the effect of processing variables on the structure and morphology of Nano-TIM 会议论文 HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007-06-26 作者:  Wang, Wen Xuan[1];  Lu, Xiuzhen[2];  Liu, Johan[3];  Wang, Xu[4];  Cheng, Zhaonian[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Manufacturing and characterization of nano silver particles based thermal interface material 会议论文 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS 作者:  Liu, Johan[1];  Olorunyomi, Michael Olugbenga[2];  Li, Xin[3];  Shangguan, Dongkai[4] 收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10 Manufacturing and characterization of nano sliver particles based thermal interface material 会议论文 57th Electronic Components and Technology Conference 2007, ECTC '07, 2007-05-29 作者:  Liu, Johan[1];  Olorunyomi, Michael Olugbenga[2];  Li, Xin[3];  Shangguan, Dongkai[4] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 中文点阵显示智能卡能耗控制器 专利 申请日期: 2007-01-01, 作者:  刘建影[1];  上官东恺[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10 Investigation of dielectric strength of electrospun nanofiber based thermal interface material 会议论文 HDP'07: PROCEEDINGS OF THE 2007 INTERNATIONAL SYMPOSIUM ON HIGH DENSITY PACKAGING AND MICROSYSTEM INTEGRATION, 2007-06-26 作者:  Wang, Xu[1];  Wang, Wenxuan[2];  Li, Xin[3];  Carlberg, Bjoern[4];  Lu, Xiuzhen[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 electrospinning  dielectric strength  nanofiber  thermal interface material   Study of interfacial reactions in Sn-3.5Ag-3.0Bi and Sn-8.0Zn-3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2007, 卷号: 437, 页码: 169-179 作者:  Sun, Peng[1];  Andersson, Cristina[2];  Wei, Xicheng[3];  Cheng, Zhaonian[4];  Shangguan, Dongkai[5] 收藏  |  浏览/下载：4/0  |  提交时间：2019/05/10 lead-free solder  interfacial reaction  Cu diffusion  intermetallic compound (IMC)