Nanostructured polymer-metal composite for thermal interface material applications | |
Carlberg, Bj?rn[1]; Wang, Teng[2]; Fu, Yifeng[3]; Liu, Johan[4]; Shangguan, Dongkai[5] | |
2008 | |
会议名称 | 58th Electronic Components and Technology Conference |
会议日期 | 2008-05-27 |
页码 | 191-+ |
URL标识 | 查看原文 |
内容类型 | 会议论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/2345565 |
专题 | 上海大学 |
作者单位 | [1]Department of Microtechnology and Nanoscience , SMIT Center, Chalmers University of Technology, SE-412 96, G?teborg, Sweden [2]Department of Microtechnology and Nanoscience , SMIT Center, Chalmers University of Technology, SE-412 96, G?teborg, Sweden [3]Department of Microtechnology and Nanoscience , SMIT Center, Chalmers University of Technology, SE-412 96, G?teborg, Sweden [4]Department of Microtechnology and Nanoscience , SMIT Center, Chalmers University of Technology, SE-412 96, G?teborg, Sweden |Key State Laboratory for New Displays and System Applications, SMIT Center, Shanghai University, Yanchang Road 149, Shanghai 200072, China[5]Key State Laboratory for New Displays and System Applications, SMIT Center, Shanghai University, Yanchang Road 149, Shanghai 200072, China |
推荐引用方式 GB/T 7714 | Carlberg, Bj?rn[1],Wang, Teng[2],Fu, Yifeng[3],et al. Nanostructured polymer-metal composite for thermal interface material applications[C]. 见:58th Electronic Components and Technology Conference. 2008-05-27. |
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