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	Nanostructured polymer-metal composite for thermal interface material applications
	Carlberg, Bj?rn[1]; Wang, Teng[2]; Fu, Yifeng[3]; Liu, Johan[4]; Shangguan, Dongkai[5]
	2008
会议名称	58th Electronic Components and Technology Conference
会议日期	2008-05-27
页码	191-+
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2345565
专题	上海大学
作者单位	[1]Department of Microtechnology and Nanoscience , SMIT Center, Chalmers University of Technology, SE-412 96, G?teborg, Sweden [2]Department of Microtechnology and Nanoscience , SMIT Center, Chalmers University of Technology, SE-412 96, G?teborg, Sweden [3]Department of Microtechnology and Nanoscience , SMIT Center, Chalmers University of Technology, SE-412 96, G?teborg, Sweden [4]Department of Microtechnology and Nanoscience , SMIT Center, Chalmers University of Technology, SE-412 96, G?teborg, Sweden |Key State Laboratory for New Displays and System Applications, SMIT Center, Shanghai University, Yanchang Road 149, Shanghai 200072, China[5]Key State Laboratory for New Displays and System Applications, SMIT Center, Shanghai University, Yanchang Road 149, Shanghai 200072, China
推荐引用方式 GB/T 7714	Carlberg, Bj?rn[1],Wang, Teng[2],Fu, Yifeng[3],et al. Nanostructured polymer-metal composite for thermal interface material applications[C]. 见:58th Electronic Components and Technology Conference. 2008-05-27.

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