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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:  Yu, Weiyuan;  Li, Binbin;  Wu, Baolei;  Wang, Fengfeng;  Wang, Mingkang
收藏  |  浏览/下载:22/0  |  提交时间:2022/08/09
Influence mechanism of thermoelectric coupling on microstructure of aluminum/steel continuous drive friction welding joints 期刊论文
Cailiao Gongcheng/Journal of Materials Engineering, 2022, 卷号: 50, 期号: 5, 页码: 35-42
作者:  Zhang, Changqing;  Wang, Shuwen;  Luo, Dechun;  Shi, Wenchen;  Liu, Xiao
收藏  |  浏览/下载:28/0  |  提交时间:2022/06/20
Time-impact optimal trajectory planning of vehicle-mounted cleaning mobile manipulator 期刊论文
Taiyangneng Xuebao/Acta Energiae Solaris Sinica, 2022, 卷号: 43, 期号: 4, 页码: 283-287
作者:  C., Li;  K., Chen;  N., Wang;  J., Gong
收藏  |  浏览/下载:32/0  |  提交时间:2022/06/20
Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载:19/0  |  提交时间:2020/11/14
Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/14
Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804
作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载:9/0  |  提交时间:2019/11/15
Interface Stability of Skutterudite Thermoelectric Materials/Ti88Al12 期刊论文
JOURNAL OF INORGANIC MATERIALS, 2018, 卷号: 33, 期号: 8, 页码: 889, 894
作者:  Zhang Qi-Hao;  Liao Jin-Cheng;  Tang Yun-Shan;  Gu Ming;  Liu Rui-Heng
收藏  |  浏览/下载:31/0  |  提交时间:2018/12/28
Duration of Thermal Stability and Mechanical Properties of Mg2Si/Cu Thermoelectric Joints 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 5, 页码: 2591-2599
作者:  Cai, Lanlan;  Li, Peng*;  Wang, Pei;  Luo, Qi;  Zhai, Pengcheng
收藏  |  浏览/下载:14/0  |  提交时间:2019/12/04
Carbon Nanoparticle Hybrid Aerogels: 3D Double-Interconnected Network Porous Microstructure, Thermoelectric, and Solvent-Removal Functions 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2017, 卷号: 9, 期号: 26, 页码: 21820-21828
作者:  Tan, Dongxing;  Zhao, Jian;  Gao, Caiyan;  Wang, Hanfu;  Chen, Guangming
收藏  |  浏览/下载:28/0  |  提交时间:2018/04/13
Study on the High Temperature Interfacial Stability of Ti/Mo/Yb0.3Co4Sb12 Thermoelectric Joints 期刊论文
APPLIED SCIENCES-BASEL, 2017, 卷号: 7, 期号: 9
作者:  Gu, Ming;  Bai, Shengqiang;  Xia, Xugui;  Huang, Xiangyang;  Li, Xiaoya
收藏  |  浏览/下载:22/0  |  提交时间:2018/12/29


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