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CORC

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Effect of Electric Field on the Microstructure and Properties of Brazed Joints of Float Glass and Kovar 4J29 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2021, 卷号: 50, 期号: 11, 页码: 4003-4009
作者:  Yu Weiyuan;  Yang Guoqing;  Sun Xuemin;  Wang Fengfeng;  Zhang Tao
收藏  |  浏览/下载：10/0  |  提交时间：2022/03/01
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：21/0  |  提交时间：2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：15/0  |  提交时间：2022/02/17
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：17/0  |  提交时间：2021/02/03
Reactive infiltration and microstructural characteristics of Sn-V active solder alloys on porous graphite 期刊论文
Materials, 2020, 卷号: 13, 期号: 7
作者:  Zhang, Yubin;  Liao, Xinjiang;  Lin, Qiaoli;  Mu, Dekui;  Lu, Jing
收藏  |  浏览/下载：6/0  |  提交时间：2020/11/14
Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond 期刊论文
Applied Surface Science, 2020, 卷号: 504
作者:  Liao, Xinjiang;  He, Qiqi;  Lin, Qiaoli;  Mu, Dekui;  Huang, Hui
收藏  |  浏览/下载：3/0  |  提交时间：2020/11/14
Transient Soldering Reaction Mechanisms of SnCu Solder on CuNi Nano Conducting Layer and Fracture Behavior of the Joint Interfaces 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 5, 页码: 3383-3390
作者:  Zhang, Qingke;  Hu, Fangqin;  Song, Zhenlun
收藏  |  浏览/下载：115/0  |  提交时间：2020/12/16
Low-temperature wetting of sapphire using Sn–Ti active solder alloys 期刊论文
Ceramics International, 2019, 卷号: 45, 期号: 17, 页码: 22175-22182
作者:  Mu, Dekui;  Feng, Kuiyuan;  Lin, Qiaoli;  Huang, Han
收藏  |  浏览/下载：17/0  |  提交时间：2020/11/14
Investigations on elastic properties and electronic structures of alpha-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements 期刊论文
RESULTS IN PHYSICS, 2019, 卷号: 15
作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：12/0  |  提交时间：2022/03/01
Thermoelectric interface materials: A perspective to the challenge of thermoelectric power generation module 期刊论文
JOURNAL OF MATERIOMICS, 2019, 卷号: 5, 期号: 3, 页码: 321
作者:  Liu, Weishu;  Bai, Shengqiang
收藏  |  浏览/下载：89/0  |  提交时间：2019/12/26

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