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| In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
Q. K. Zhang; Z. F. Zhang
  收藏 | 浏览/下载：10/0 | 提交时间：2012/04/13
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| SnPb焊点结构的高周疲劳行为检测与寿命表征方法 期刊论文
2010, 2010
王习术; 阎成琨; Murai Ryosuke; 赵海燕; Wang Xi-Shu; Yan Cheng-Kun; Murai Ryosuke; Zhao Hai-Yan
收藏 | 浏览/下载：2/0 |
| Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录) 会议
作者: Li, Wang-Yun[1]; Cao, Shan-Shan[1]; Zhang, Xin-Ping[1]
收藏 | 浏览/下载：3/0 | 提交时间：2019/04/11
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| Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录) 会议
作者: Li, Wang-Yun[1]; Cao, Shan-Shan[1]; Zhang, Xin-Ping[1]
收藏 | 浏览/下载：4/0 | 提交时间：2019/04/11
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| The influence of imposed electric current on the tensile fracture behavior of micro-scale Cu/Sn-3.0Ag-0.5Cu/Cu solder joints (CPCI-S收录) 会议论文
2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
作者: Li, Wang-Yun[1]; Qin, Hong-Bo[1]; Zhou, Min-Bo[1]; Zhang, Xin-Ping[1]
收藏 | 浏览/下载：1/0 | 提交时间：2019/04/12
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