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Catalytic Application and Mechanism Studies of Argentic Chloride Coupled Ag/Au Hollow Heterostructures: Considering the Interface Between Ag/Au Bimetals. 期刊论文
Nanoscale research letters, 2019, 卷号: Vol.14 No.1, 页码: 35
作者:  Jun Liu;  Zhaohui Wu;  Quanguo He;  Qingyong Tian;  Wei Wu
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/13
Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications 期刊论文
MICROSYSTEMS & NANOENGINEERING, 2019, 卷号: 5, 页码: 20
作者:  An, Zhonglie;  Li, Jinhua;  Kikuchi, Akio;  Wang, Zhuqing;  Jiang, Yonggang
收藏  |  浏览/下载：101/0  |  提交时间：2019/12/30
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Design and Implementation of Micro-Liquid Jetting System Featuring Piezostack Actuator for Microelectronic Packaging 会议论文
International Conference on Electronics and Electrical Engineering Technology (EEET), SEP 19-21, 2018
作者:  Lu, Shizhou;  Ren, Chenliang;  Shan, Xiaohui;  Liu, Wei;  Zhu, Chenyu
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/31
Design and implementation of micro-liquid jetting system featuring piezostack actuator for microelectronic packaging 会议论文
2018 International Conference on Electronics and Electrical Engineering Technology, EEET 2018, September 19, 2018 - September 21, 2018
作者:  Lu, Shizhou;  Ren, Chenliang;  Shan, Xiaohui;  Liu, Wei;  Zhu, Chenyu
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/31
Binary Synergistic Sensitivity Strengthening of Bioinspired Hierarchical Architectures based on Fragmentized Reduced Graphene Oxide Sponge and Silver Nanoparticles for Strain Sensors and Beyond 期刊论文
SMALL, 2017
Zhao, Songfang; Guo, Lingzhi; Li, Jinhui; Li, Ning; Zhang, Guoping; Gao, Yongju; Li, Jia; Cao, Duxia; Wang, Wei; Jin, Yufeng; Sun, Rong; Wong, Ching-Ping
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
Modelling and characterisation of a micromachined resonant pressure sensor with piezoelectric excitation and sensing 期刊论文
MICRO & NANO LETTERS, 2016, 卷号: 11, 期号: [db:dc_citation_issue], 页码: 326-331
作者:  Cheng, Rongjun;  Zhao, Yulong;  Li, Cun;  Li, Bo;  Zhang, Qi
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Evaluation of Thermal Mechanical Reliability of Three Dimensional Packaging System with Redundant TSVs 其他
2016-01-01
Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration 其他
2016-01-01
Liu, Huan; Zeng, Qinghua; Guan, Yong; Fang, Runiu; Sun, Xin; Su, Fei; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03

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