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Multiobjective Evolutionary Algorithm Based on Nondominated Sorting and Bidirectional Local Search for Big Data 期刊论文
IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, 2017, 卷号: 13, 期号: 4, 页码: 1979-1988
作者:  Lin, Fan;  Zeng, Jiasong;  Xiahou, Jianbing;  Wang, Beizhan;  Zeng, Wenhua
收藏  |  浏览/下载:7/0  |  提交时间:2019/08/19
Multiobjective Evolutionary Algorithm Based on Nondominated Sorting and Bidirectional Local Search for Big Data 期刊论文
IEEE TRANSACTIONS ON INDUSTRIAL INFORMATICS, 2017, 卷号: 13, 期号: 4, 页码: 1979-1988
作者:  Lin, Fan;  Zeng, Jiasong;  Xiahou, Jianbing;  Wang, Beizhan;  Zeng, Wenhua
收藏  |  浏览/下载:2/0  |  提交时间:2018/12/07
Atomic Scale Imaging of Nucleation and Growth Trajectories of an Interfacial Bismuth Nanodroplet 期刊论文
ACS NANO, 2016, 卷号: 10, 期号: 2, 页码: 2386-2391
作者:  Li, YX (Li, Yingxuan);  Bunes, BR (Bunes, Benjamin R.);  Zang, L (Zang, Ling);  Zhao, J (Zhao, Jie);  Li, Y (Li, Yan)
收藏  |  浏览/下载:102/0  |  提交时间:2016/03/22
Direct observation of amplified spontaneous emission of surface plasmon polaritons at metal/dielectric interfaces 期刊论文
APPLIED PHYSICS LETTERS, 2011, 卷号: 98, 期号: 26
Chen, YH; Li, JF; Ren, ML; Wang, BL; Fu, JX; Liu, SY; Li, ZY
收藏  |  浏览/下载:10/0  |  提交时间:2013/09/17
Fracture characterization of Carbon fiber-reinforced polymer-concrete bonded interfaces under four-point bending 期刊论文
ENGINEERING FRACTURE MECHANICS, 2011, 卷号: 78, 期号: 6, 页码: 1247-1263
作者:  Qiao, Pizhong;  Zhang, Lei;  Chen, Fangliang;  Chen, Ying;  Shan, Luyang
收藏  |  浏览/下载:2/0  |  提交时间:2019/12/23
Atomically smooth ultrathin films of topological insulator Sb2Te3 期刊论文
NANO RESEARCH, 2010, 卷号: 3, 期号: 12, 页码: 874
Wang, GA; Zhu, XG; Wen, J; Chen, X; He, K; Wang, LL; Ma, XC; Liu, Y; Dai, X; Fang, Z; Jia, JF; Xue, QK
收藏  |  浏览/下载:35/0  |  提交时间:2013/09/17
Study on LD-pumped Nd:YAG laser cutter (EI CONFERENCE) 会议论文
ICO20: Lasers and Laser Technologies, August 21, 2005 - August 26, 2005, Changchun, China
Cui J.; Zhao J.; Fan Z.; Zhao C.; Bi Y.; Zhang J.; Niu G.; Shi Z.; Pei B.; Zhang G.; Xue Y.; Qi Y.
收藏  |  浏览/下载:14/0  |  提交时间:2013/03/25
The theory of laser cutter and the technology neck is analyzed. We can conclude that it is almost impossible to deal with the waste thick silicon wafers which are yielded in producing silicon wafers by conventional eroding or diamond cutting  when the cutting velocity equals 100mm/min  while it is also unperfected with ecumenical laser cutter without good beam quality or precise laseroptics system. It is represented that high average power and high repetition rate laser with good beam quality and precise laseroptics system are pivotal to obtain excellent cutting effect such as thick groove depth  double-layer 0.75mm thick silicon wafer can be penetrated.. The cross section is fine and the groove is narrow  rapid cutting speed  the cutting quality meets the expecting demand.  fine kerf section without considering the effect of technique. Considering laser medium thermal lens effect and thermal focal length changing with pumping power  using plano-convex high reflectivity mirror as the back cavity mirror to compensate the heat lens influence  a /4 waveplate to compensate heat -induced birefraction  utilize the Nd:YAG self- aperture effect  more than 50 W average power 1.064 um IR output is obtained with beam quality factor (M2) equals 3.19. Through the LD-Pumped Nd:YAG laser cutter we developed with short focus length negative spherical aberration focusing lens  double axis linear step motor positioning system  suitable beam expander multiplying factor  appropriate diameter of exit beam aperture  proper repetition rate  when the cutting velocity equals 400mm/min  0.75mm thick silicon wafer can be penetrated  


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