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CORC

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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
作者:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.
收藏  |  浏览/下载：25/0  |  提交时间：2021/02/03
Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 428-437
作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15
Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 77-89
作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：26/0  |  提交时间：2021/02/02
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：43/0  |  提交时间：2021/02/02
Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment 会议论文
Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:  Xu, Hongyan;  Li, Jianqiang;  Ning, Puqi;  Xu, Ju
收藏  |  浏览/下载：20/0  |  提交时间：2019/06/21
Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment 期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1709, 1715
作者:  Xu, HY;  Li, JQ;  Ning, PQ;  Xu, J;  Xu, Hongyan
收藏  |  浏览/下载：21/0  |  提交时间：2018/12/29
Apparatus and methods for micro-transfer printing 专利
专利号: WO2016012409A3, 申请日期: 2016-03-24, 公开日期: 2016-03-24
作者:  BOWER, CHRISTOPHER;  MEITL, MATTHEW;  KNEEBURG, DAVID;  GOMEZ, DAVID;  BONAFEDE, SALVATORE
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
A Novel XML-Based Document Format with Printing Quality for Web Publishing 其他
2010-01-01
Qiu, Ruiheng; Tang, Zhi; Gao, Liangcai; Yu, Yinyan
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13

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