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CORC

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Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer 期刊论文
JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29
作者:  Zhang, Ping;  Zhang, Xian;  Ding, Xin;  Wang, Yanyan;  Xiao, Chao
收藏  |  浏览/下载：20/0  |  提交时间：2022/12/23
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：10/0  |  提交时间：2022/07/01
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：16/0  |  提交时间：2022/01/27
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：12/0  |  提交时间：2021/03/15
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8
作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
收藏  |  浏览/下载：133/0  |  提交时间：2021/02/02
Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020
作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun
收藏  |  浏览/下载：3/0  |  提交时间：2020/12/16
TENSILE  JOINTS  SILVER  CU  
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
作者:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Effects of Ag on the microstructure and shear strength of rapidly solidified Sn–58Bi solder 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 7
作者:  Liu, Shengfa;  Song, Tianjie;  Xiong, Wenyong;  Liu, Li;  Liu, Zhangyang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 20, 页码: 18524-18538
作者:  Wang, Z.;  Zhang, Q. K.;  Chen, Y. X.;  Song, Z. L.
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/18
Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging 期刊论文
Journal of Electronic Materials, 2018, 卷号: 47, 期号: 9, 页码: 5588-5594
作者:  Liu, Shengfa;  Xiong, Wenyong*;  Xiong, Jieran;  Tan, Guanghua;  Hu, Zhebing
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04

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