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	Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging
	Liu, Shengfa; Xiong, Wenyong*; Xiong, Jieran; Tan, Guanghua; Hu, Zhebing; Chen, Chen; Huang, Shangyu
刊名	Journal of Electronic Materials
	2018
卷号	47期号:9页码:5588-5594
关键词	Sn-3.5Ag eutectic solder rapid solidification Bi microstructure
ISSN号	0361-5235
DOI	10.1007/s11664-018-6448-6
URL标识	查看原文
WOS记录号	WOS:000440111200088;EI:20182705390180
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/3391711
专题	武汉理工大学
作者单位	1.[Chen, Chen 2.Huang, Shangyu 3.Hu, Zhebing 4.Liu, Shengfa 5.Tan, Guanghua 6.Xiong, Wenyong] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan 430070, Hubei, Peoples R China.
推荐引用方式 GB/T 7714	Liu, Shengfa,Xiong, Wenyong*,Xiong, Jieran,et al. Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging[J]. Journal of Electronic Materials,2018,47(9):5588-5594.
APA	Liu, Shengfa.,Xiong, Wenyong*.,Xiong, Jieran.,Tan, Guanghua.,Hu, Zhebing.,...&Huang, Shangyu.(2018).Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging.Journal of Electronic Materials,47(9),5588-5594.
MLA	Liu, Shengfa,et al."Refinement Mechanism of Bi Addition on the Microstructure of Rapidly Solidified Sn-3.5Ag Eutectic Solder for Microelectronic Packaging".Journal of Electronic Materials 47.9(2018):5588-5594.

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