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浏览/检索结果: 共10条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration 期刊论文 ACTA MATERIALIA, 2015, 卷号: 100, 页码: 98-106 作者:  Huang, M. L.;  Zhao, J. F.;  Zhang, Z. J.;  Zhao, N. 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09 Electromigration  beta-Sn grain orientation  Solder bump  Dissolution  Intermetallic compounds   Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 mu m Sn-Ag-Cu solder bumps 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 卷号: 602, 页码: 281-284 作者:  Huang, M. L.;  Yang, F.;  Zhao, N.;  Yang, Y. C. 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 Intermetallics  Crystal growth  Synchrotron radiation  Ag3Sn  Undercooling  Precipitation   Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn-Ag-Cu solder bumps 期刊论文 Journal of Alloys and Compounds, 2014, 卷号: 602, 页码: 281-284 作者:  Huang ML(黄明亮);  Zhao N(赵宁) 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/11 Preparation of Sn-Ag-In Solder Bumps by Electroplating of Sn-Ag and Indium in Sequence and the Effect of Indium Addition on Microstructure and Shear Strength 期刊论文 IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2012, 卷号: 2, 期号: 8, 页码: 1275-1279 Wang, DL; Yuan, Y; Luo, L 收藏  |  浏览/下载：18/0  |  提交时间：2013/04/23 Indium additive influence  microstructural change  shear strength  Sn-Ag-In solder bumps   Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2012, 卷号: 23, 期号: 1, 页码: 61-67 Wang, DL; Yuan, Y; Luo, L 收藏  |  浏览/下载：16/0  |  提交时间：2013/04/25 Preparation of Sn - Ag - in ternary solder bumps by electroplating in sequence and reliability 期刊论文 Journal of Semiconductors., 2011, 卷号: 32, 期号: 8, 页码: 083005 Wang, Dongliang; Yuan, Yuan; Luo,L 收藏  |  浏览/下载：9/0  |  提交时间：2012/08/23 Preparation of Sn - Ag - in ternary solder bumps by electroplating in sequence and reliability 期刊论文 Journal of Semiconductors., 2011, 卷号: 32, 期号: 8, 页码: 083005 Wang, Dongliang; Yuan, Yuan; Luo,L 收藏  |  浏览/下载：11/0  |  提交时间：2012/08/23 A mems probe card with 2d dense-arrayed 'hoe'-shaped metal tips 期刊论文 Journal of micromechanics and microengineering, 2008, 卷号: 18, 期号: 5, 页码: 8 作者:   收藏  |  浏览/下载：11/0  |  提交时间：2019/05/10 Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2008, 卷号: 37, 期号: 3, 页码: 307-313 Lin, XQ; Luo, L 收藏  |  浏览/下载：31/0  |  提交时间：2012/03/24 EUTECTIC SNPB  TIN-LEAD  JOINTS  CU  GROWTH  COPPER  MICROSTRUCTURE  INTERMETALLICS  TECHNOLOGY  MORPHOLOGY   Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2008, 卷号: 37, 期号: 3 Pages, 页码: 307-313 Lin, XQ; Luo, L 收藏  |  浏览/下载：18/0  |  提交时间：2012/05/12