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浏览/检索结果: 共13条，第1-10条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：42/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism   Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 5, 页码: 3876-3889 作者:  Xu, Tao;  Hu, Xiaowu;  Li, Jiayin;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Coatings  Fracture mechanics  Fracture testing  Sandwich structures  Thermal aging  Fractographic  Fracture behavior  Growth behavior  Mixed fractures  Pinning effects  Shear failure mode  Solder joints  Solid-state aging   The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642 作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ 收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05 Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength   Preparation and connection performance analysis of solder paste by low-temperature sintering Cu nanoparticles 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2018, 卷号: 39, 期号: 6, 页码: 72-76 作者:  Yang, Wanchun;  Wang, Shuai;  Zhu, Wenbo;  Wei, Jun;  Li, Mingyu 收藏  |  浏览/下载：25/0  |  提交时间：2018/12/28 Microstructural and mechanical characteristics of laser welding of Ti6Al4V and lead metal 期刊论文 JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2012, 卷号: 212, 期号: 7, 页码: 1520-1527 作者:  Zhao SS(赵树森);  Yu G(虞钢);  He XL(何秀丽);  Hu YW(胡耀武);  Zhao, SS 收藏  |  浏览/下载：65/0  |  提交时间：2013/01/18 Laser welding  Welding of different materials  Interfaces  Microstructure  Mechanical properties  Ni Dissimilar Couple  Molten Pool  Titanium  Aluminum   Effect of Pb Content on Thermal Fatigue Life of Mixed SnAgCu-SnPb Solder Joints (CPCI-S收录) 会议 作者:  Wen Qiang[1,2];  Li Xunping[2];  Li Guoyuan[1] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/11 Mixed solder joints  Pb content  Thermal fatigue life   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array   Effect of Pb content on thermal fatigue life of mixed SnAgCu-SnPb solder joints (EI收录) 会议 Wuhan, China, 作者:  Wen, Qiang[1,2];  Li, Xunping[2];  Li, Guoyuan[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Electronics packaging  Lead  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Soldered joints  Thermal fatigue   Study on Fatigue Ductility Coefficient and Life Prediction for Mixed Solder Joints under Thermal Cycle Loads (CPCI-S收录) 会议论文 PROCEEDINGS OF 2014 10TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY (ICRMS), VOLS I AND II 作者:  Zhou, Bin[1];  Lu, Tao[1,2];  You, Jincheng[1,3] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/12 Mixed solder joint  thermal cycles  fatigue ductility coefficient  failure