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The microstructure and mechanical properties of titanium/copper welded joint by FSW
期刊论文
MATERIALS SCIENCE AND TECHNOLOGY, 2022
作者:
Li, Jie
;
Zhou, Peng
;
Wei, Guijiang
;
Huang, Jiankang
;
Shi, Hongyuan
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2022/07/19
Titanium
copper
welded joint
FSW
intermediate layer Ag
microstructure
mechanical properties
Influence mechanism of thermoelectric coupling on microstructure of aluminum/steel continuous drive friction welding joints
期刊论文
Cailiao Gongcheng/Journal of Materials Engineering, 2022, 卷号: 50, 期号: 5, 页码: 35-42
作者:
Zhang, Changqing
;
Wang, Shuwen
;
Luo, Dechun
;
Shi, Wenchen
;
Liu, Xiao
收藏
  |  
浏览/下载:26/0
  |  
提交时间:2022/06/20
Crack tips
Dissimilar metals
Failure analysis
Friction
Growth rate
Low carbon steel
Aluminum steel
Aluminum/steel dissimilar joint
Continuous drive friction welding
Dissimilar joints
Intermetallic compound layer
Intermetallics compounds
Joint interfaces
Tensile fractures
Thermoelectric
Thermoelectric coupling
The Growth Behavior for Intermetallic Compounds at the Interface of Aluminum-Steel Weld Joint
期刊论文
MATERIALS, 2022, 卷号: 15, 期号: 10
作者:
Yu, Xiaoquan
;
Huang, Jiankang
;
Yang, Tao
;
Fan, Ding
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2022/06/21
Al-Fe intermetallic compounds
growth kinetics
aluminum-steel weld joint
numerical simulation
Wetting behavior and interfacial characteristics of Ti33Zr17Cu50 amorphous alloy on AlN
期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 29
作者:
Wang, Le
;
Lin, Qiaoli
;
Liu, Lu
;
Sui, Ran
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  |  
浏览/下载:25/0
  |  
提交时间:2022/04/21
Amorphous alloy
Temperature
Wettability
Precursor film
Interface
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints
期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:
Gao, Li-Yin
;
Luo, Yi-Xiu
;
Wan, Peng
收藏
  |  
浏览/下载:264/0
  |  
提交时间:2021/10/15
Solder joint
Intermetallic compound
Mechanical property
Nano-indentation
First principle calculation
Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Fengfeng
;
Wang, Yanhong
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  |  
浏览/下载:13/0
  |  
提交时间:2021/03/02
Copper
Tin
Ultrasonic effects
Ultrasonic testing
Ultrasonic waves
Wetting
Acoustic cavitations
Additional forces
Copper substrates
Cross-section morphology
Interfacial atoms
Ultrasonic sound
Ultrasonic vibration
Wetting balance methods
Microstructure and interfacial reactions of resistance brazed lap joints between tc4 titanium alloy and 304 stainless steel using metal powder interlayers
期刊论文
Materials, 2021, 卷号: 14, 期号: 1, 页码: 1-10
作者:
Zhang, Pengxian
;
Fang, Zhizhong
;
Li, Shilong
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  |  
浏览/下载:23/0
  |  
提交时间:2021/03/02
Austenitic stainless steel
Binary alloys
Brazing
Filler metals
Iron compounds
Iron metallurgy
Metals
Microstructure
Titanium alloys
Titanium compounds
Titanium metallurgy
304 stainless steel
Atomic reactions
Brazing process
Comparative experiments
Formation mechanism
Metallurgical behavior
Shear strength of joint
TC4 titanium alloy
Microstructure and Interfacial Reactions of Resistance Brazed Lap Joints between TC4 Titanium Alloy and 304 Stainless Steel Using Metal Powder Interlayers
期刊论文
MATERIALS, 2021, 卷号: 14, 期号: 1, 页码: -
作者:
Zhang, Pengxian
;
Fang, Zhizhong
;
Li, Shilong
收藏
  |  
浏览/下载:27/0
  |  
提交时间:2021/03/12
STAINLESS-STEEL JOINTS
MECHANICAL-PROPERTIES
FILLER
BEHAVIOR
Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs
期刊论文
Vacuum, 2020, 卷号: 180
作者:
Qiu, Hongyu
;
Hu, Xiaowu
;
Li, Shuang
;
Wan, Yongqiang
;
Li, Qinglin
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Binary alloys
Copper alloys
Elastic moduli
Fracture
Fracture mechanics
Shear flow
Soldered joints
Surface analysis
Tin alloys
Area ratios
Fracture mechanisms
Fracture surface analysis
Fracture surfaces
Fractured surfaces
Isothermal aging
Lead-free solder joint
Solder joints
The effect of finish layer on the interfacial cracking failure of Au-Si bonding
期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
作者:
Gao, Li-Yin
;
Wen, Jian
;
Li, Cai-Fu
;
Chen, Chunhuan
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2021/02/02
AuSi bonding
NiCo
Intermetallic compounds (IMCs)
Failure analysis
Crack
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