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科研机构
兰州理工大学 [11]
厦门大学 [6]
地理科学与资源研究所 [6]
上海硅酸盐研究所 [5]
山东大学 [3]
北京大学 [2]
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期刊论文 [42]
会议论文 [5]
学位论文 [3]
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Moderate operation scales of agricultural land under the greenhouse and open-field production modes based on DEA model in mountainous areas of southwest China
期刊论文
HELIYON, 2023, 卷号: 9, 期号: 11, 页码: 13
作者:
Li, Ming
;
Zhao, Weizhao
;
Tian, Congshan
;
Li, Yaqi
;
Feng, Xuechun
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2024/02/27
Agricultural land
Agriculture efficiency
Data envelopment analysis
Rural revitalization
Sustainable agriculture
Microstructure Evolution of an Al-Si Alloy During Shear-vibration Coupling Sub-rapid Solidification and the Effects of Processing Parameters
期刊论文
International Journal of Metalcasting, 2022
作者:
Zhang, Zongxu
;
Chen, Tijun
;
Xue, Han
;
Bi, Guangli
;
Ma, Ying
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2022/07/20
Aluminum alloys
Shear flow
Silicon alloys
Textures
Vibrations (mechanical)
Al-alloy
Dissociation and proliferation of grain
Pouring temperatures
Primary particles
Semisolid slurries
Shear vibrations
Shear-vibration coupling sub-rapid solidification
Sub-rapid solidification
Vibration coupling
Vibration frequency
AGGRAVATING EFFECTS OF FOOD EXPORT RESTRICTIONS UNDER CLIMATE CHANGE ON FOOD SECURITY: AN ANALYSIS OF RICE ECONOMY BASED ON ALTERNATIVE INDICATORS
期刊论文
CLIMATE CHANGE ECONOMICS, 2022, 卷号: 13, 期号: 2
作者:
Liu, Yawen
;
Yang, Lingyu
;
Zhang, Jinzhu
;
Cui, Qi
;
Liu, Yu
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2023/05/30
Climate change
export restrictions
household consumption
self-sufficiency rate
CGE model
Structural, magnetic, optical, and impedance properties of SrxCo1−xFe2O4 nanoparticles prepared by sol–gel method
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 16, 页码: 21262-21277
作者:
Zhang, Yanchun
;
Sun, Aimin
;
Shao, Liqiong
;
Suonan, Zhaxi
;
Chen, Jingzhou
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2022/02/17
Chemical elements
Cobalt compounds
Ferrite
Iron compounds
Light absorption
Nanomagnetics
Optical properties
Scanning electron microscopy
Sols
Spectrometers
Strontium compounds
X ray photoelectron spectroscopy
Characteristic bands
Complex impedance spectroscopy
Energy dispersive spectrometers
Fourier transform infrared
Grain resistance
Impedance properties
Optical absorption properties
VIS spectroscopy
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:
Qiu, Hongyu
;
Xu, Han
;
Zhang, Chuge
;
Hu, Xiaowu
;
Jiang, Xiongxin
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2022/02/17
Binary alloys
Copper alloys
Electromigration
Tensile strength
Tin alloys
Bonding joints
Co content
Coaddition
Current direction
Electric density
Micro-structure evolutions
Solder joints
Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate
期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 1, 页码: 1073-1079
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wang, Fengfeng
;
Wang, Yanhong
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2021/03/02
Copper
Tin
Ultrasonic effects
Ultrasonic testing
Ultrasonic waves
Wetting
Acoustic cavitations
Additional forces
Copper substrates
Cross-section morphology
Interfacial atoms
Ultrasonic sound
Ultrasonic vibration
Wetting balance methods
Food-away-from-home plate waste in China: Preference for variety and quantity
期刊论文
FOOD POLICY, 2020, 卷号: 97, 页码: 7
作者:
Xu, Zhigang
;
Zhang, Zongli
;
Liu, Haiyan
;
Zhong, Funing
;
Bai, Junfei
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2021/03/15
Plate waste
Preference for variety
Portion size
Food-away-from-home
Incorporating ecosystem services into agricultural management based on land use/cover change in Northeastern China
期刊论文
TECHNOLOGICAL FORECASTING AND SOCIAL CHANGE, 2019, 卷号: 144, 页码: 401-411
作者:
Zhan, Jinyan
;
Chu, Xi
;
Li, Zhihui
;
Jia, Siqi
;
Wang, Guofeng
收藏
  |  
浏览/下载:44/0
  |  
提交时间:2019/09/24
Value of ecosystem services
LUCC
Agricultural management
Value coefficients
Monetary units
Northeastern China
Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 10, 页码: 9410-9420
作者:
Zhang, Xudong
;
Hu, Xiaowu
;
Jiang, Xiongxin
;
Li, Qinglin
;
Zhou, Liuru
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Binary alloys
Geometry
Intermetallics
Lead-free solders
Morphology
Polychlorinated biphenyls
Silver compounds
Soldered joints
Tin alloys
Aging time
Compressive strain
Enhanced effects
Growth of intermetallics
Kirkendall void
Mean diameter
Polyhedron shapes
Solder joints
Enhanced energy storage properties in Nb-modified Bi0.5Na0.5TiO3–SrTiO3 lead-free electroceramics
期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 6, 页码: 5780-5790
作者:
Tong, Xing-Ye
;
Song, Min-Wei
;
Zhou, Jia-Jun
;
Wang, Ke
;
Guan, Chun-Lin
收藏
  |  
浏览/下载:12/0
  |  
提交时间:2021/05/06
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