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Fatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading [循环电载荷下大功率LED金引线疲劳断裂寿命预测] 期刊论文
Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics, 2019, 卷号: 45, 页码: 478-485
作者:  Fan, J.;  Li, L.;  Qian, C.;  Hu, A.;  Fan, X.
收藏  |  浏览/下载:12/0  |  提交时间:2019/12/30
Progress in Ultrasonic Bonding Wire Process and Quality Evaluation of Bonding Point 会议论文
作者:  Zhao ZL;  Mo DF;  Wu JR;  Jiang MD;  Zhang JL
收藏  |  浏览/下载:30/0  |  提交时间:2018/11/20
Submount, encapsulated semiconductor element, and methods of manufacturing the same 专利
专利号: US9263411, 申请日期: 2016-02-16, 公开日期: 2016-02-16
作者:  SONG, XUELIANG;  SATO, NOZOMU;  KANNO, GENTA;  MAKINO, YOHKO
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/24
The spin filter effect of iron-cyclopentadienyl multidecker clusters: the role of the electrode band structure and the coupling strength 期刊论文
nanotechnology, 2009
Shen, Xin; Yi, Zelong; Shen, Ziyong; Zhao, Xingyu; Wu, Jinlei; Hou, Shimin; Sanvito, Stefano
收藏  |  浏览/下载:1/0  |  提交时间:2015/11/13
Structural stabilities and electronic structures of Ti atomic chains 期刊论文
http://dx.doi.org/10.1016/j.physe.2005.08.010, 2005
Li, A. Y.; Li, R. Q.; Zhu, Z. Z.; Wen, Y. H.; 文玉华
收藏  |  浏览/下载:3/0  |  提交时间:2013/12/12
Structural stabilities and electronic structures of Ti atomic chains 期刊论文
http://dx.doi.org/10.1016/j.physe.2005.08.010, 2005
Li, A. Y.; Li, R. Q.; Zhu, Z. Z.; Wen, Y. H.; 朱梓忠
收藏  |  浏览/下载:3/0  |  提交时间:2013/12/12
Evaluation of bondability and reliability of single crystal copper wire bonding 会议论文
Shanghai, China, June 27, 2005 - June 29, 2005
作者:  Hua, Chen;  Lee, S. W. Ricky;  Yutian, Ding
收藏  |  浏览/下载:0/0  |  提交时间:2020/11/15
Semiconductor laser 专利
专利号: JP1990181987A, 申请日期: 1990-07-16, 公开日期: 1990-07-16
作者:  SASAKI YOSHIHIRO
收藏  |  浏览/下载:9/0  |  提交时间:2020/01/13
Multibeam semiconductor laser device 专利
专利号: JP1988141385A, 申请日期: 1988-06-13, 公开日期: 1988-06-13
作者:  SHIMADA KATSUTO
收藏  |  浏览/下载:11/0  |  提交时间:2020/01/13
Multibeam semiconductor laser device 专利
专利号: JP1988141386A, 申请日期: 1988-06-13, 公开日期: 1988-06-13
作者:  SHIMADA KATSUTO
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/31


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