Fatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading [循环电载荷下大功率LED金引线疲劳断裂寿命预测] | |
Fan, J.; Li, L.; Qian, C.; Hu, A.; Fan, X.; Zhang, G. | |
刊名 | Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics |
2019 | |
卷号 | 45页码:478-485 |
关键词 | Fatigue of materials Forecasting Fracture Gold Outages Reliability Wire Acceleration factors Fatigue fracture Gold bonding wires High-power light-emitting diodes Lifetime prediction Mechanical simulations Packaging technologies Reliability assessments Light emitting diodes |
ISSN号 | 10015965 |
DOI | 10.13700/j.bh.1001-5965.2018.0401 |
URL标识 | 查看原文 |
收录类别 | EI |
内容类型 | 期刊论文 |
URI标识 | http://www.corc.org.cn/handle/1471x/5919272 |
专题 | 北京航空航天大学 |
推荐引用方式 GB/T 7714 | Fan, J.,Li, L.,Qian, C.,等. Fatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading [循环电载荷下大功率LED金引线疲劳断裂寿命预测][J]. Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics,2019,45:478-485. |
APA | Fan, J.,Li, L.,Qian, C.,Hu, A.,Fan, X.,&Zhang, G..(2019).Fatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading [循环电载荷下大功率LED金引线疲劳断裂寿命预测].Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics,45,478-485. |
MLA | Fan, J.,et al."Fatigue fracture lifetime prediction for gold bonding wires of high-power LED under cyclically electrical loading [循环电载荷下大功率LED金引线疲劳断裂寿命预测]".Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics 45(2019):478-485. |
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