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Study of the dynamic wetting behavior of Sn droplet impacting Cu substrate 期刊论文
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING, 2022, 卷号: 128, 期号: 8
作者:  Yu, Weiyuan;  Wang, Mingkang;  Wang, Fengfeng;  Wang, Xiwushan;  Wu, Baolei
收藏  |  浏览/下载:18/0  |  提交时间:2022/07/19
Enhanced Boiling Heat Transfer Performance on Mini-pin-finned Copper Surfaces in FC-72 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2022, 卷号: 34, 期号: 3, 页码: 15
作者:  Chen, Hongqiang;  Xu, Pengzhuo;  Du, Wangfang;  Zhang, Yonghai;  Zhu, Zhiqiang
收藏  |  浏览/下载:59/0  |  提交时间:2022/07/18
Rational fabrication of superhydrophobic surfaces with coalescence-induced droplet jumping behavior for atmospheric corrosion protection 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2022, 卷号: 428, 页码: 12
作者:  Chen, Xiaotong;  Wang, Peng;  Zhang, Dun;  Ou, Junfei
收藏  |  浏览/下载:50/0  |  提交时间:2022/02/18
超疏水表面的海洋大气腐蚀防护机制研究 学位论文
中国科学院海洋研究所: 中国科学院大学, 2021
作者:  陈晓彤
收藏  |  浏览/下载:70/0  |  提交时间:2021/06/08
Effect of Cu Surface Microcosmic Morphology on the Inert Wetting and Reactive Wetting 期刊论文
Cailiao Daobao/Materials Reports, 2020, 卷号: 34, 期号: 16, 页码: 16109-16113
作者:  Yang, Haipeng;  Shi, Yu;  Lin, Qiaoli;  Ci, Wenjuan;  Zhang, Gang
收藏  |  浏览/下载:4/0  |  提交时间:2020/11/14
Rough surface of copper-bearing titanium alloy with multifunctions of osteogenic ability and antibacterial activity 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 48, 页码: 130-139
作者:  Liu, Hui;  Liu, Rui;  Ullah, Ihsan;  Zhang, Shuyuan;  Sun, Ziqing
收藏  |  浏览/下载:23/0  |  提交时间:2021/02/02
Rough surface of copper-bearing titanium alloy with multifunctions of osteogenic ability and antibacterial activity 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 48, 页码: 130-139
作者:  Liu, Hui;  Liu, Rui;  Ullah, Ihsan;  Zhang, Shuyuan;  Sun, Ziqing
收藏  |  浏览/下载:24/0  |  提交时间:2021/02/02
Hierarchical iron-doped CoP heterostructures self-assembled on copper foam as a bifunctional electrocatalyst for efficient overall water splitting 期刊论文
JOURNAL OF COLLOID AND INTERFACE SCIENCE, 2020, 卷号: 569, 页码: 140-149
作者:  Huang, Xiaokang;  Gong, Li;  Xu, Hui;  Qin, Jiaheng;  Ma, Ping
收藏  |  浏览/下载:3/0  |  提交时间:2020/06/16
Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin
收藏  |  浏览/下载:14/0  |  提交时间:2020/06/16
Tailoring self-lubricating, wear-resistance, anticorrosion and antifouling properties of Ti/(Cu, MoS2)-DLC coating in marine environment by controlling the content of Cu dopant 期刊论文
TRIBOLOGY INTERNATIONAL, 2020, 卷号: 143
作者:  Zhang, Jingwen;  Wang, Yongxin;  Zhou, Shengguo;  Wang, Yuecheng;  Wang, Chunting
收藏  |  浏览/下载:66/0  |  提交时间:2020/12/16


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