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	Predicting the variation of stacking fault energy for binary Cu alloys by first-principles calculations 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 53, 页码: 61-65 作者: Cai, T.; Li, K. Q.; Zhang, Z. J.; Zhang, P.; Liu, R. 收藏 \| 浏览/下载：34/0 \| 提交时间：2021/02/02 Cu-alloy Deformation behavior First-principles calculation Stacking fault energy
	Wetting behavior of Cu6Sn5 IMC by molten Sn 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 3, 页码: 33-37 作者: Li, Fuxiang; Wang, Jianbin; Ye, Changsheng; Lin, Qiaoli 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Activation energy Binary alloys Gold Oxide films Substrates Tin compounds Ion sputtering Linear variation Metallic substrate Modified sessile drop method Reaction limiteds Spreading dynamics Wetting behavior Wetting process
	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	Liquid-liquid hierarchical separation and metal recycling of waste printed circuit boards 期刊论文 JOURNAL OF HAZARDOUS MATERIALS, 2019, 卷号: 364, 页码: 388-395 作者: Chen, Bin; He, Jie; Xi, Yaoyao; Zeng, Xiangfeng; Kaban, Ivan 收藏 \| 浏览/下载：50/0 \| 提交时间：2019/06/04 Waste printed circuit boards Metal recycling Liquid-liquid phase separation Immiscible alloys Super-gravity technology Pyrolysis
	Liquid-liquid hierarchical separation and metal recycling of waste printed circuit boards 期刊论文 JOURNAL OF HAZARDOUS MATERIALS, 2019, 卷号: 364, 页码: 388-395 作者: Chen, Bin; He, Jie; Xi, Yaoyao; Zeng, Xiangfeng; Kaban, Ivan 收藏 \| 浏览/下载：3/0 \| 提交时间：2021/02/02 Waste printed circuit boards Metal recycling Liquid-liquid phase separation Immiscible alloys Super-gravity technology Pyrolysis
	Liquid-liquid hierarchical separation and metal recycling of waste printed circuit boards 期刊论文 JOURNAL OF HAZARDOUS MATERIALS, 2019, 卷号: 364, 页码: 388-395 作者: Chen, Bin; He, Jie; Xi, Yaoyao; Zeng, Xiangfeng; Kaban, Ivan 收藏 \| 浏览/下载：2/0 \| 提交时间：2021/02/02 Waste printed circuit boards Metal recycling Liquid-liquid phase separation Immiscible alloys Super-gravity technology Pyrolysis
	Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology 期刊论文 Journal of Alloys and Compounds, 2019, 卷号: 781 作者: Liu, Shengfa; Zhang, Dongxiao; Xiong, Jieran; Chen, Chen; Song, Tianjie 收藏 \| 浏览/下载：9/0 \| 提交时间：2019/12/05
	Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623–723K 期刊论文 Journal of Alloys and Compounds, 2018, 卷号: 767, 页码: 877-882 作者: Lin, Qiaoli; Li, Fuxiang; Wang, Jianbin 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Copper oxides Gold Intermetallics Joining Lead-free solders Oxide films Oxide minerals Soldering Substrates Tin Cu intermetallics Driving forces Key factors Lead-Free Metallic substrate Precipitation reaction Sessile drop method Thin oxide films
	Wetting of Sn/Cu and Sn/Cu-Sn IMCs at 623-723K 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 767, 页码: 877-882 作者: Lin, Qiaoli; Li, Fuxiang; Wang, Jianbin 收藏 \| 浏览/下载：26/0 \| 提交时间：2019/11/15 Wettability Soldering Joining Lead-free Intermetallics
	Effects of Bath Temperature on Co-electroplating Au-Sn Alloys for Electronic Packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16 作者: Tang, Fangwu; Huang, Mingliang; Huang, Feifei 收藏 \| 浏览/下载：2/0 \| 提交时间：2019/12/09 bath temperaturet co-electroplating Au-Sn alloys electrochemical behavior

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