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	Shear fatigue cracking of twin boundary and grain boundary without dislocation impingement 期刊论文 Scripta Materialia, 2015, 卷号: 100, 页码: 28-31 L. L.; Zhang Li, Z. J.; Zhang, P.; Yang, J. B.; Zhang, Z. F. 收藏 \| 浏览/下载：24/0 \| 提交时间：2015/05/08 Bicrystal Grain boundary Twin boundary Cyclic deformation Fatigue cracking stage-i propagation high-strain fatigue cyclic deformation slip bands copper bicrystals nucleation fcc initiation mechanisms morphology
	Effect of crystallographic orientation and grain boundary character on fatigue cracking behaviors of coaxial copper bicrystals 期刊论文 Acta Materialia, 2013, 卷号: 61, 期号: 2, 页码: 425-438 L. L. Li; P. Zhang; Z. J. Zhang; Z. F. Zhang 收藏 \| 浏览/下载：20/0 \| 提交时间：2013/12/24 Copper bicrystal Interfacial energy Crystallographic orientation Grain boundary Twin boundary cyclic deformation-behavior persistent slip bands structure-energy correlation centered-cubic metals stage-i propagation high strain fatigue low-alloy steel transfer mechanisms single-crystals twin boundaries
	The formation of stacking fault tetrahedra in Al and Cu II SFT growth by successive absorption of vacancies generated by dipole annihilation 期刊论文 Acta Materialia, 2011, 卷号: 59, 期号: 1, 页码: 41200 H. Wang; D. S. Xu; R. Yang; P. Veyssiere 收藏 \| 浏览/下载：19/0 \| 提交时间：2012/04/13 Stacking fault tetrahedron Dislocation dipole Dislocation annihilation Molecular dynamics simulations Vacancy cluster edge-dislocation dipoles fcc metals tensile properties single-crystals quenched gold temperature-dependence point-defects atomic-scale part i copper
	Microstructure evolution of Zr(2)Al(3)C(4) in Cu matrix 期刊论文 Journal of Materials Research, 2011, 卷号: 26, 期号: 3, 页码: 372-383 J. Zhang; J. Y. Wang; Y. C. Zhou 收藏 \| 浏览/下载：21/0 \| 提交时间：2012/04/13 metal-ceramic interfaces thermal-expansion crystal-structure part i x-ray composites copper ti3alc2 al temperature
	The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges 期刊论文 Acta Materialia, 2011, 卷号: 59, 期号: 1, 页码: 19-29 H. Wang; D. S. Xu; R. Yang; P. Veyssiere 收藏 \| 浏览/下载：21/0 \| 提交时间：2012/04/13 Stacking fault tetrahedron Growth Ledge mechanism Molecular dynamics simulations Shockley dipole vacancy clusters quenched gold fcc metals molecular-dynamics glissile dislocations irradiated materials elastic interaction point-defects part i copper
	Low-cycle fatigue-cracking mechanisms in fcc crystalline materials 期刊论文 Philosophical Magazine, 2011, 卷号: 91, 期号: 2, 页码: 237-257 P. Zhang; S. Qu; Q. Q. Duan; S. D. Wu; S. X. Li; Z. G. Wang; Z. F. Zhang 收藏 \| 浏览/下载：22/0 \| 提交时间：2012/04/13 fcc crystals fatigue crack dislocation grain boundary twin boundary slip band shear band deformation band copper single-crystals persistent slip bands perpendicular grain-boundary severe plastic-deformation constant strain amplitude stage-i propagation twin boundaries tensile properties shear bands behavior
	Cyclic deformation and fatigue cracking behaviors of Cu-28wt%Ag binary alloy 期刊论文 Philosophical Magazine, 2009, 卷号: 89, 期号: 21, 页码: 1715-1730 Y. Z. Tian; Z. F. Zhang; Z. G. Wang 收藏 \| 浏览/下载：15/0 \| 提交时间：2012/04/13 Cu-Ag alloy cyclic deformation slip bands fatigue cracking interphase interface fatigue striation copper single-crystals persistent slip bands constant strain amplitude stage-i propagation grain-boundary mechanical-properties stainless-steels high-strength initiation nucleation
	Grain boundary effects on cyclic deformation and fatigue damage 期刊论文 Progress in Materials Science, 2008, 卷号: 53, 期号: 7, 页码: 1025-1099 Z. F. Zhang; Z. G. Wang 收藏 \| 浏览/下载：19/0 \| 提交时间：2012/04/13 copper single-crystals stress-strain response persistent slip bands beta-brass bicrystal elastic interaction stresses low amplitude fatigue stage-i propagation polycrystalline copper dislocation-structures crack initiation
	Electrochemical deposition and characterization of Cu2O nanowires 期刊论文 Applied Physics a-Materials Science & Processing, 2005, 卷号: 81, 期号: 4, 页码: 685-689 X. M. Liu; Y. C. Zhou 收藏 \| 浏览/下载：11/0 \| 提交时间：2012/04/14 anodic alumina copper(i) oxide epitaxial electrodeposition magnetic-properties cuprous-oxide large-area films fabrication arrays nanomaterials
	Electrochemical deposition and characterization of Cu2O nanowires 期刊论文 Applied Physics a-Materials Science & Processing, 2005, 卷号: 81, 期号: 4, 页码: 685-689 X. M. Liu; Y. C. Zhou 收藏 \| 浏览/下载：11/0 \| 提交时间：2012/05/17 anodic alumina copper(i) oxide epitaxial electrodeposition magnetic-properties cuprous-oxide large-area films fabrication arrays nanomaterials

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