The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges

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	The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges
	H. Wang ; D. S. Xu ; R. Yang ; P. Veyssiere
刊名	Acta Materialia
	2011
卷号	59 期号:1 页码:19-29
关键词	Stacking fault tetrahedron Growth Ledge mechanism Molecular dynamics simulations Shockley dipole vacancy clusters quenched gold fcc metals molecular-dynamics glissile dislocations irradiated materials elastic interaction point-defects part i copper
ISSN号	1359-6454
中文摘要	Ledge expansion and the concomitant growth of a stacking fault tetrahedron (SFT) are investigated in Al and Cu by molecular dynamics (MD) simulations by addition of vacancy rods with selected lengths Ledge expansion is largely governed by the site preference of vacancies on the SFT edges resulting in distinct stable ledged SFTs Both edge- and corner-facing ledge configurations may be adopted The growth of SFTs, especially large ones, is controlled by thermal agitation The mobile part of the ledges consists of a dipole of Shockley partials generally oriented in the 60 degrees mixed orientation that move in a thermally activated manner, reflecting a certain core reorganization of the Shockley dipole (C) 2010 Acta Materialia Inc Published by Elsevier Ltd All rights reserved
原文出处	://WOS:000284789200003
公开日期	2012-04-13
内容类型	期刊论文
源URL	[http://210.72.142.130/handle/321006/30725]
专题	金属研究所_中国科学院金属研究所
推荐引用方式 GB/T 7714	H. Wang,D. S. Xu,R. Yang,et al. The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges[J]. Acta Materialia,2011,59(1):19-29.
APA	H. Wang,D. S. Xu,R. Yang,&P. Veyssiere.(2011).The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges.Acta Materialia,59(1),19-29.
MLA	H. Wang,et al."The formation of stacking fault tetrahedra in Al and Cu III Growth by expanding ledges".Acta Materialia 59.1(2011):19-29.