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CORC

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Numerical and experimental investigation of glow discharge cleaning on SSRF beamline 期刊论文
VACUUM, 2019, 卷号: 163, 页码: 135-141
作者:  Li, Bo;  Chen, Ming;  Liu, Jia;  Xue, Song
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Abnormal migration behavior and segregation mechanism of Bi atoms undergoing liquid-solid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE, 2019, 卷号: 54, 页码: 7975-7986
作者:  Zhang, Z. J.;  Huang, M. L.
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/Sn-9Zn/Ni interconnect under temperature gradient 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2018, 卷号: 216, 页码: 130-135
作者:  Zhong, Y.;  Zhao, N.;  Dong, W.;  Wang, Y. P.;  Ma, H. T.
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Influence of Cryorolling on the Precipitation of Cu-Ni-Si Alloys: An In Situ X-ray Diffraction Study 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2018, 卷号: 31, 页码: 1089-1097
作者:  Wang, Wei;  Chen, Zong-Ning;  Guo, En-Yu;  Kang, Hui-Jun;  Liu, Yi
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Synchrotron radiation micro-beam analysis of the effect of strontium on primary silicon in Zn-27Al-3Si alloy 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 749, 页码: 575-579
作者:  Chen, Fei;  Cao, Zhiqiang;  Chen, Gang;  Kai, Xizhou;  Wu, Jili
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/02
Effect of Eu on the silicon phase in Al-40Zn-5Si alloys 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 722, 页码: 116-130
作者:  Mao, Feng;  Li, Junqi;  Yan, Guangyuan;  Zou, LongJiang;  Cao, Zhiqiang
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn addition 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 695, 页码: 1436-1443
作者:  Zhong, Y.;  Zhao, N.;  Ma, H. T.;  Dong, W.;  Huang, M. L.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
In situ observation on the solidification of Sn-10Cu hyperperitectic alloy under direct current field by synchrotron microradiography 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 721, 页码: 126-133
作者:  Xuan, Zhenjing;  Mao, Feng;  Cao, Zhiqiang;  Wang, Tongmin;  Zou, Longjiang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Ma, H. R.;  Li, S.;  Yao, M. J.;  Wang, Y. P.;  Chen, J.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
In situ study the effects of Cu addition on the rapidly growth of Cu6Sn5 at the Sn-base solder/Cu L-S interface during soldering heat preservation stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Chen, Jun;  Zhao, Ning
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03

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