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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：西安交通大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of geometry error on accuracy of large-diameter pads used for CMP dressing 期刊论文 International Journal of Advanced Manufacturing Technology, 2019, 卷号: 100, 页码: 1505-1520 作者:  Ban, X.X.;  Zhao, H.Y.;  Zhao, S.J.;  Xie, R.Q.;  Gu, Y.W. 收藏  |  浏览/下载：14/0  |  提交时间：2019/11/19 Chemical mechanical polishing(CMP)  Geometry errors  Measured values  Polishing pads  Polyurethane pads  Profile accuracies  Spherical surface  Surface profiles   Design of an ultraprecision computerized numerical control chemical mechanical polishing machine and its implementation 期刊论文 OPTICAL ENGINEERING, 2018, 卷号: 57 作者:  Zhang, Chupeng;  Zhao, Huiying;  Zhu, Xueliang;  Zhao, Shijie;  Jiang, Chunye 收藏  |  浏览/下载：9/0  |  提交时间：2019/11/26 chemical mechanical polishing  design principle  diamond tool dressing  gas hydrostatic linear guideway  gas hydrostatic rotary table  kinematic errors  tin plate  ultraprecision machine tool   Improvement and application of pad conditioning accuracy in chemical mechanical polishing 期刊论文 Optical Engineering, 2018, 卷号: 57 作者:  Ban, Xinxing;  Zhao, Huiying;  Zhu, Xueliang;  Zhao, Shijie;  Xie, Ruiqing 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/26 Application process  Chemical mechanical polishing(CMP)  Density distributions  Diamond conditioners  Kinematic Analysis  Optical processing  Planarity  Process parameters   Effect of motion accuracy on material removal during the CMP process for large-aperture plane optics 期刊论文 INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 卷号: 94, 页码: 105-119 作者:  Zhang, C. P.;  Zhao, H. Y.;  Xie, R. Q.;  Zhao, Z. X.;  Gu, Y. W. 收藏  |  浏览/下载：3/0  |  提交时间：2019/11/26 Chemical mechanical polishing  Run-out error  Stitching measurement  Uneven removal  Polishing efficiency and accuracy  Gas hydrostatic rotary table  Large-aperture optics   Effect of indentation speed on deformation behaviors of surface modified silicon: A molecular dynamics study 期刊论文 Computational Materials Science, 2018, 卷号: 155, 页码: 1-10 作者:  Chen, Juan;  Shi, Junqin;  Zhang, Meng;  Peng, Weixiang;  Fang, Liang 收藏  |  浏览/下载：6/0  |  提交时间：2019/11/26 Amorphous SiO2  Amorphous structures  Chemical-mechanical polishing process  Crystalline-to-amorphous  Deformation behavior  Molecular dynamics simulations  Nanoindentation tests  Surface-modified   Design of an ultra-precision CNC chemical mechanical polishing machine and its implementation 会议论文 作者:  Zhang, Chupeng;  Zhao, Huiying;  Gu, Yawen;  Ban, Xinxing;  Jiang, Chunye 收藏  |  浏览/下载：8/0  |  提交时间：2019/11/26 Chemical mechanical polishing  Tin plate  Gas hydrostatic rotary table  Ultra-precision machine tool  Design principle  Diamond tool dressing  Kinematic errors  Gas hydrostatic linear guideway   Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method 期刊论文 FRICTION, 2017, 卷号: 5, 页码: 99-107 作者:  Zhu, Aibin;  He, Dayong;  He, Shengli;  Luo, Wencheng 收藏  |  浏览/下载：7/0  |  提交时间：2019/11/26 particle size  chemical mechanical polishing  material removal mechanism  quasi-continuum  single crystal copper   Role of crystal orientation on chemical mechanical polishing of single crystal copper 期刊论文 APPLIED SURFACE SCIENCE, 2016, 卷号: 386, 期号: [db:dc_citation_issue], 页码: 262-268 作者:  Zhu, Aibin;  He, Dayong;  Luo, Wencheng;  Liu, Yangyang 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02 Chemical mechanical polishing  Crystal orientation  Single crystal copper  Quasi-continuum method   Investigation for material removal mechanism in copper chemical mechanical polishing with quasi-continuum method 期刊论文 Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University, 2011, 卷号: 45, 期号: [db:dc_citation_issue], 页码: 111-116 作者:  Zhu, Aibin;  Lu, Xinchun;  Zhang, Hao;  Chen, Wei;  Xie, Youbai 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/10 Abrasive particles  Copper chemical-mechanical polishing  Material deformation  Material removal mechanisms  Quasi-continuum methods  Residual stress layers  Single crystal copper  Tangential cutting force