| Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method | |
| Zhu, Aibin; He, Dayong; He, Shengli; Luo, Wencheng | |
| 刊名 | FRICTION
 |
| 2017 | |
| 卷号 | 5页码:99-107 |
| 关键词 | particle size chemical mechanical polishing material removal mechanism quasi-continuum single crystal copper |
| ISSN号 | 2223-7690 |
| URL标识 | 查看原文 |
| 内容类型 | 期刊论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/2941303 |
| 专题 | 西安交通大学 |
| 推荐引用方式 GB/T 7714 | Zhu, Aibin,He, Dayong,He, Shengli,et al. Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method[J]. FRICTION,2017,5:99-107. |
| APA | Zhu, Aibin,He, Dayong,He, Shengli,&Luo, Wencheng.(2017).Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method.FRICTION,5,99-107. |
| MLA | Zhu, Aibin,et al."Material removal mechanism of copper chemical mechanical polishing with different particle sizes based on quasi-continuum method".FRICTION 5(2017):99-107. |
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