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兰州理工大学 [14]

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限定条件	专题：兰州理工大学第一署名单位第一作者单位通讯作者单位

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	Investigation of effects of pattern structures arrangement on chemical mechanical polishing process 会议论文 Shanghai, China, March 11, 2018 - March 12, 2018 作者: Wu, Lixiao; Hahn, Sookap; Yan, Changfeng 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/15 Chemical mechanical polishing Pressure distribution Semiconductor device manufacture Signal processing Silicon wafers Textile printing Chemical-mechanical polishing process Contact pressure distribution Pattern arrangement Pattern structure Polishing processs Splitting signals
	Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP 期刊论文 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：12/0 \| 提交时间：2019/11/15 Polishing parameters wafer patterns chemical mechanical polishing (CMP) linear system contact pressure
	Effects of polishing parameters on evolution of different wafer patterns during Cu CMP 期刊论文 IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Copper Elastic moduli Erosion Linear systems Polishing Topography Chemical mechanical polishing(CMP) Contact pressures High selectivity Polishing parameters Polishing processs Preston coefficients Selectivity ratio Wafer patterns
	Effects of polishing parameters on the evolution of wafer patterns during Cu CMP 会议论文作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/15 Copper Linear systems Polishing Chemical mechanical polishing(CMP) IC industry Linear system model Pattern density Polishing parameters Selectivity ratio Square waves Wafer patterns
	Effects of polishing parameters on the evolution of 3-D wafer patterns during CMP 会议论文 Shanghai, China, March 19, 2013 - March 21, 2013 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/15 Polishing Pressure distribution Semiconductor device manufacture Silicon wafers Chemical mechanical polishing(CMP) Contact pressure distribution Linear modeling Magnitude spectrum Polishing parameters Polishing processs Polishing time Wafer patterns
	An analytical model for contact height and contact pressure in chemical mechanical polishing (CMP) for different pattern structure 会议论文 Shanghai, China, March 18, 2012 - March 19, 2012 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：7/0 \| 提交时间：2020/11/15 Analytical models Chemical analysis Polishing Semiconductor device manufacture Silicon wafers Textile printing Chemical mechanical polishing(CMP) Contact pressures Pattern density Pattern designs Pattern evolution Pattern structure Polishing parameters
	An analytical model of contact pressure caused by 2-D wafer topography in chemical-mechanical polishing process 会议论文 Shanghai, China, March 18, 2012 - March 19, 2012 作者: Wu, Lixiao 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/15 Chemical analysis Geometry Polishing Semiconductor device manufacture Silicon wafers Topography Chemical mechanical polishing(CMP) Chemical-mechanical polishing process Contact pressures Elastic half space Linear time-invariant system Magnitude spectrum Pattern features Wafer topography
	An analytical model of contact pressure distribution caused by 3-D wafer topography in chemical-mechanical polishing processes 期刊论文 Journal of the Electrochemical Society, 2012, 卷号: 159, 期号: 3, 页码: H266-H276 作者: Wu, Lixiao 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Chemical analysis Chemical mechanical polishing Linear systems Polishing Topography Chemical-mechanical polishing process Contact pressure distribution Contact pressures Different densities Linear combinations Linear elasticity theory Magnitude spectrum Polishing parameters
	Modeling copper chemical mechanical polishing processes using linear system method 会议论文作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：8/0 \| 提交时间：2020/11/15 Copper Erosion Linear systems Polishing Semiconductor device manufacture Textile printing Copper chemical-mechanical polishing Down force Pattern structure Solid-solid contacts
	Modeling of the effect of wafer topography on chemical mechanical polishing processes based on 3D analysis 期刊论文 Journal of the Electrochemical Society, 2011, 卷号: 158, 期号: 3, 页码: H239-H248 作者: Wu, Lixiao; Yan, Changfeng 收藏 \| 浏览/下载：0/0 \| 提交时间：2020/11/14 Chemical analysis Polishing Pressure distribution Topography Chemical mechanical polishing(CMP) Chemical-mechanical polishing process Contact pressure distribution Different densities Linear combinations Magnitude spectrum Polishing parameters Three-dimensional (3D) solids

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