QQ客服 官方微博 反馈留言

浏览/检索结果: 共4条，第1-4条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Uncertainty Analysis of Heat Transfer Properties of Corrugated-core Sandwich Panel 会议论文 2016 INTERNATIONAL CONFERENCE ON MECHANICS DESIGN, MANUFACTURING AND AUTOMATION (MDM 2016), 2016-01-01 作者:  Qi, Wu-Chao;  Li, Dong-Wei;  Liu, Heng 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/30 Uncertainty analysis  Corrugated-core sandwich panel  Heat transfer  Integrated thermal protection system   Uncertainty Analysis of Heat Transfer Properties of Corrugated-core Sandwich Panel 会议论文 International Conference on Mechanics Design, Manufacturing and Automation (MDM), Suzhou, PEOPLES R CHINA 作者:  Qi, Wu-Chao;  Li, Dong-Wei;  Liu, Heng 收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30 Uncertainty analysis  Corrugated-core sandwich panel  Heat transfer  Integrated thermal protection system   DESIGN AND HEAT TRANSFER RESEARCH OF GAN-BASED INTEGRATED MODULE 会议论文 作者:  Guo, Yixuan 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/03 integrated module  GaN  heat transfer  parasitic inductance   Numerical investigation of heat transfer and pressure loss of double-layer microchannels for chip liquid cooling 会议论文 作者:  Xie, Gongnan;  Liu, Yanquan;  Sunden, Bengt;  Zhang, Weihong;  Zhao, Jun 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/10 Double layers  Electronic chips  Integrated electronics  Laminar heat transfer  Liquid cooling  Liquid cooling technology  Numerical investigations  Thermal characteristics