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	Numerical investigation of heat transfer and pressure loss of double-layer microchannels for chip liquid cooling
	Xie, Gongnan; Liu, Yanquan; Sunden, Bengt; Zhang, Weihong; Zhao, Jun
	2012
关键词	Double layers Electronic chips Integrated electronics Laminar heat transfer Liquid cooling Liquid cooling technology Numerical investigations Thermal characteristics
卷号	2
期号	[db:dc_citation_issue]
DOI	[db:dc_identifier_doi]
页码	575-583
会议录	ASME 2012 Heat Transfer Summer Conf. Collocated with the ASME 2012 Fluids Engineering Div. Summer Meeting and the ASME 2012 10th Int. Conf. on Nanochannels, Microchannels and Minichannels, HT 2012
URL标识	查看原文
ISSN号	9780791844786
WOS记录号	[DB:DC_IDENTIFIER_WOSID]
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/4456113
专题	西安交通大学
推荐引用方式 GB/T 7714	Xie, Gongnan,Liu, Yanquan,Sunden, Bengt,et al. Numerical investigation of heat transfer and pressure loss of double-layer microchannels for chip liquid cooling[C]. 见:.

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