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A finite element approach for determining the dynamic behaviours of multiscale beams using the semi-continuum model 会议论文
作者:  Zhang, Ning;  Shen, Jiping;  Li, Cheng
收藏  |  浏览/下载:8/0  |  提交时间:2019/11/19
Further Investigation on the Flow and Heat Transfer Mechanism of Single-Jet Film Cooling Based on Hybrid Thermal Lattice Boltzmann Method 会议论文
作者:  Shangguan, Yanqin;  Wang, Xian;  Zhang, Hu;  Li, Yueming
收藏  |  浏览/下载:10/0  |  提交时间:2019/11/19
Suitability of material models in finite element simulation of stress relaxation for titanium sheets 会议论文
Journal of Physics: Conference Series, 2018-07-30
作者:  Li, X.Q.;  Dong, H.R.;  Guo, G.Q.;  Li, D.S.
收藏  |  浏览/下载:14/0  |  提交时间:2019/12/30
DUGKS simulations of three-dimensional Taylor-Green vortex flow and turbulent channel flow 会议论文
Bo, Yuntian; Wang, Peng; Guo, Zhaoli; Wang, Lian-Ping
收藏  |  浏览/下载:7/0  |  提交时间:2017/12/03
Study of cooldown thermal loading effect on the bore deformation of viscoelastic solid propellant grain 会议论文
53rd AIAA/SAE/ASEE Joint Propulsion Conference, 2017, 2017-07-10
作者:  Adel, W.M.;  Liang, G.-Z.
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/30
Developing a viscoelastic relaxation model for AP-HTPB composite solid propellant based on experimental data 会议论文
21st AIAA International Space Planes and Hypersonics Technologies Conference, Hypersonics 2017, 2017-03-06
作者:  Adel, W.M.;  Liang, G.-Z.
收藏  |  浏览/下载:1/0  |  提交时间:2019/12/30
Three-dimensional phase-field lattice Boltzmann model for incompressible multiphase flows 会议论文
作者:  Wang, Ningning;  Liu, Haihu;  Zhang, Chuhua
收藏  |  浏览/下载:4/0  |  提交时间:2019/12/02
Multi-Period OPF with Energy Storages and Renewable Sources: A Parallel Moment Approach 会议论文
作者:  Duan, Chao;  Jiang, Lin;  Fang, Wanliang;  Liu, Jun
收藏  |  浏览/下载:3/0  |  提交时间:2019/11/26
Parallel Overlapping Mechanism Between Communication and Computation of the Lattice Boltzmann Method 会议论文
3rd International Conference on High-Performance Computing and Applications (HPCA), 2015-07-26
作者:  Liu, Zhixiang[1];  Fang, Yong[2];  Song, Anping[3];  Xu, Lei[4];  Wang, Xiaowei[5]
收藏  |  浏览/下载:7/0  |  提交时间:2019/04/26
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC, 2015-12-02
作者:  Zeng, Q.;  Guan, Y.;  Su, F.;  Chen, J.;  Jin, Y.
收藏  |  浏览/下载:7/0  |  提交时间:2019/12/30


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