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	Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill
	Zeng, Q.; Guan, Y.; Su, F.; Chen, J.; Jin, Y.
	2016
会议名称	Proceedings of the Electronic Packaging Technology Conference, EPTC
会议日期	2015-12-02
关键词	Chip scale packages Electronics packaging Finite element method Reliability Thermal cycling Viscoelasticity Chip deformations Relaxation modulus Silicon interposers Temperature dependent Thermal-mechanical reliability Time dependent Viscoelastic properties Williams-Landel-Ferry equations Three dimensional integrated circuits
卷号	2016-February
收录类别	EI
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/5958627
专题	北京航空航天大学
推荐引用方式 GB/T 7714	Zeng, Q.,Guan, Y.,Su, F.,et al. Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill[C]. 见:Proceedings of the Electronic Packaging Technology Conference, EPTC. 2015-12-02.

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