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Effect of thermal stress on the electrical properties of TSV inductor 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Wang, Fengjuan;  Liu, Jingting;  Yu, Ningmei
收藏  |  浏览/下载：11/0  |  提交时间：2019/12/20
Electrical Resistivity Model for SSTA of Cu Nanowires 会议论文
2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019-01-01
作者:  Li, Jianwei;  Dai, Li;  Yu, Ningmei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/20
Influence of the morphology of alumina filler on electrical and thermal properties of epoxy resin composites 会议论文
作者:  Ma, Jiawei;  Gao, Naikui;  Ren, Tengyue;  Pan, Zehua;  Jin, Haiyun
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/19
Preparation and influencing factors of molybdenum targets and magnetron-sputter-deposited molybdenum thin films 会议论文
作者:  An, Geng;  Sun, Jun;  Sun, Yuan Jun;  Cao, Wei Cheng
收藏  |  浏览/下载：12/0  |  提交时间：2019/11/19
Application of comprehensive geophysical prospecting method in groundwater exploration 会议论文
作者:  Yang, Fan;  Gao, Pengju;  Li, Dong;  Ma, Hanwen;  Cheng, Guoliang
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/26
Study on film resistivity of Energy Conversion Components for MEMS Initiating Explosive Device 会议论文
作者:  Ren, Wei;  Zhang, Bin;  Zhao, Yulong;  Chu, Enyi;  Yin, Ming
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/26
Preparation of silicon target material by adding Al-B master alloy in directional solidification 会议论文
17th IUMRS International Conference in Asia (IUMRS-ICA), Qingdao, PEOPLES R CHINA, 2016-10-20
作者:  Li, Pengting;  Wang, Kai;  Ren, Shiqiang;  Jiang, Dachuan;  Tan, Yi
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
The Effect of Slime Pulp on Electrical Properties of Insulation Pressboard 会议论文
作者:  Liu, Lilan;  Tian, Huidong;  Zhao, Fuping;  Shi, Ran;  Peng, Zongren
收藏  |  浏览/下载：8/0  |  提交时间：2019/11/26
Effect of the beta-crystal formation in isotactic polypropylene used for eco-friendly insulating material 会议论文
作者:  Zhang, Wei;  Xu, Man;  He, Ming-Xuan;  Chen, George;  Hou, Shuai
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/26
An Overview of Carbon Nanotubes Based Interconnects for Microelectronic Packaging 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Chen, Shujing[1];  Shan, Bo[2];  Yang, Yiqun[3];  Yuan, Guangjie[4];  Huang, Shirong[5]
收藏  |  浏览/下载：17/0  |  提交时间：2019/04/24

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