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CORC

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Microstructure evolution and properties evaluation of a novel bondline based on Cu@Sn Preform during temperature treatment 会议论文
Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:  Xu, Hongyan;  Li, Jianqiang;  Ning, Puqi;  Xu, Ju
收藏  |  浏览/下载：20/0  |  提交时间：2019/06/21
Enhanced hole-dominated photocatalytic activity of doughnut-like porous g-C3N4 driven by down-shifted valance band maximum 会议论文
Newcastle, AUSTRALIA, JUL 10-13, 2016
作者:  Xiao, Jiadong;  Xie, Yongbing;  Li, Chuanhao;  Kim, Jae-Hong;  Tang, Kexin
收藏  |  浏览/下载：35/0  |  提交时间：2019/06/21
An efficient and stable Cu/SiO2 catalyst for the syntheses of ethylene glycol and methanol via chemoselective hydrogenation of ethylene carbonate 会议论文
Chinese Acad Sci, Shanghai Adv Res Inst, Shanghai, PEOPLES R CHINA, JUL 17-21, 2017
作者:  Liu, Jiaju;  He, Peng;  Wang, Liguo;  Liu, Hui;  Cao, Yan
收藏  |  浏览/下载：23/0  |  提交时间：2019/06/21
Effect of morphological evolution of serrated chips on surface formation during high speed cutting Ti6Al4V 会议论文
作者:  Xu, Xiang;  Zhang, Jun;  Liu, Hongguang;  Qi, Yutong;  Liu, Zhechao
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/19
A global information based adaptive threshold for grouping large scale optimization problems 会议论文
作者:  Chen, An;  Zhang, Yipeng;  Yang, Yang;  Ren, Zhigang;  Liang, Yongsheng
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/19
Motion of a merged drop upon impacting a liquid pool 会议论文
作者:  Saha, Abhishek;  Wei, Yanju;  Tang, Xiaoyu;  Law, Chung K.
收藏  |  浏览/下载：7/0  |  提交时间：2019/11/19
Discharge characteristics of argon atmosphere dielectric barrier with different p d values 会议论文
作者:  Niu, Chao-Bin;  Qin, Shaorui;  Zhang, Xing;  Zhao, Hao-Xiang;  Liu, Xiaowei
收藏  |  浏览/下载：13/0  |  提交时间：2019/11/19
A Dynamic Generator Coherency Identification Method Based on Phase Trajectory Vector 会议论文
作者:  Yang, Songhao;  Zhang, Baohui;  Hojo, Masahide
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/19
Balancing exploration and exploitation in multiobjective evolutionary optimization 会议论文
作者:  Sun, Jianyong;  Zhang, Qingfu;  Zhang, Hu;  Chen, Huanhuan
收藏  |  浏览/下载：3/0  |  提交时间：2019/11/19
Rapid Transient Liquid Phase Sintering by Ag-In Solder Pastes for High-temperature Power Electronics 会议论文
19th International Conference on Electronic Packaging Technology (ICEPT), Inst Microelectron Chinese Acad Sci, Shanghai, PEOPLES R CHINA, AUG 08-11, 2018
作者:  Zhang, Dongxiao;  Liu, Shengfa;  Chen, Zhiwen;  Liu, Li*
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/04

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