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西安交通大学 [3]
中国石油大学(北京) [2]
兰州理工大学 [1]
大连理工大学 [1]
四川大学 [1]
上海大学 [1]
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期刊论文 [7]
会议论文 [3]
发表日期
2017 [10]
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Effects of Al content on thermal stability and mechanical properties of (Zr0.761Cu0.147Ni0.092)93-xAl7+x amorphous alloy
期刊论文
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2017, 卷号: 27, 期号: 12, 页码: 2527-2534
作者:
Zhang, Wei
;
Kou, Sheng-Zhong
;
Ai, Ya-Jun
;
Sun, Wei-Min
;
Zhao, Yan-Chun
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2020/11/14
Aluminum
Cryogenic liquids
Differential scanning calorimetry
Glass transition
Microhardness
Plastic deformation
Scanning electron microscopy
Supercooling
Zircaloy
Bulk amorphous alloys
Copper mold casting methods
Glass transition temperature Tg
Initial crystallization temperatures
Microstructures and mechanical properties
Supercooled liquid region
The differential scanning calorimeter (DSC)
Universal testing machines
Thermal and Electrical Properties of BNNPs/TiO2-Epoxy Three-phase Nanocomposites
会议论文
作者:
Yang, Mengmeng
;
Wang, Zhengdong
;
Chen, Siyu
;
Xie, Qian
;
Mao, Jiale
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/11/26
nanocomposites
boron nitride nanoplatelets
glass transition temperature
thermal conductivity
titania nanoparticles
electrical property
epoxy
Improved Glass Transition Temperature towards Thermal Stability via Thiols Solvent Additive versus DIO in Polymer Solar Cells
期刊论文
MACROMOLECULAR RAPID COMMUNICATIONS, 2017, 卷号: 38
作者:
Yin, Jingping
;
Zhou, Weihua
;
Zhang, Lin
;
Xie, Yuanpeng
;
Yu, Zoukangning
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/11/26
dynamic mechanical analysis
glass transition temperature
polymer solar cells
additives
thermal stability
Dielectric Relaxation and Carrier Transport in Epoxy Resin and its Microcomposite
期刊论文
IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2017, 卷号: 24, 页码: 3083-3091
作者:
Huang, Yin
;
Min, Daomin
;
Li, Shengtao
;
Wang, Xuan
;
Lin, Shengjun
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/11/26
glass transition temperature
Epoxy resin
charge carrier transport
dielectric relaxation process
Flexible Ultrahigh-Temperature Polymer-Based Dielectrics with High Permittivity for Film Capacitor Applications.
期刊论文
Polymers, 2017, 卷号: Vol.9 No.11, 页码: 1-12
作者:
Pu, Zejun
;
Zheng, Xiaoyi
;
Tian, Yuhan
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/02/25
DIELECTRICS
THERMAL properties
PERMITTIVITY
ADHESION
THERMOPLASTIC composites
TENSILE strength
GLASS transition temperature
The onset temperature (T-g) of AsxSe1-x glasses transition prediction: A comparison of topological and regression analysis methods
期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2017, 卷号: 140, 页码: 315-321
作者:
Liu, Yue[1]
;
Zhao, Tianlu[2]
;
Yang, Guang[3]
;
Ju, Wangwei[4]
;
Shi, Siqi[5]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/24
Onset temperature of glass transition
Topological method
Regression analysis methods
Using the viscoelastic parameters to estimate the glass transition temperature of asphalt binders
期刊论文
CONSTRUCTION AND BUILDING MATERIALS, 2017, 卷号: 153, 页码: 908-917
作者:
Liu, Jiayin
;
Sun, Yiren
;
Wang, Weiying
;
Chen, Jingyun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/09
Asphalt binder
Glass transition temperature
Viscoelastic behavior
Time-temperature superposition principle (TTSP)
Dynamic shear rheometer (DSR)
Modified Havriliak-Negami (MHN) model
Computational Thermomechanical Properties of Silica-Epoxy Nanocomposites by Molecular Dynamic Simulation
期刊论文
POLYMERS, 2017, 卷号: 9, 期号: 9
作者:
Zhang, Xiaoxing
;
Wen, Hao
;
Wu, Yunjian
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/05
silica-epoxy
glass transition temperature
grafting ratio
thermal conductivity
mechanical properties
Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity
会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA
作者:
Li, Jinze
;
Zhang, Baotan
;
Zhu, Pengli
;
Li, Gang
;
Sun, Rong
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2020/01/03
Fan-out Wafer Level Package
EMC
Thermal conductivity
Glass transition temperature
Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
-
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/01/03
Fan-out Wafer Level Package
EMC
Thermal conductivity
Glass transition temperature
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