| Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity | |
| Li, Jinze; Zhang, Baotan; Zhu, Pengli; Li, Gang; Sun, Rong; Wong, Chingping | |
| 2017 | |
| 会议名称 | 18th International Conference on Electronic Packaging Technology (ICEPT) |
| 会议地点 | IEEE, Harbin, PEOPLES R CHINA |
| 关键词 | Fan-out Wafer Level Package EMC Thermal conductivity Glass transition temperature |
| 收录类别 | CPCI-S |
| URL标识 | 查看原文 |
| WOS记录号 | WOS:000431392000242 |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/6268280 |
| 专题 | 中国石油大学（北京） |
| 推荐引用方式 GB/T 7714 | Li, Jinze,Zhang, Baotan,Zhu, Pengli,et al. Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity[C]. 见:18th International Conference on Electronic Packaging Technology (ICEPT). IEEE, Harbin, PEOPLES R CHINA. |
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