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科研机构
兰州理工大学 [2]
大连理工大学 [1]
中南大学 [1]
上海大学 [1]
内容类型
期刊论文 [5]
发表日期
2015 [5]
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Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP
期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2015, 卷号: 28, 期号: 1, 页码: 106-116
作者:
Wu, Lixiao
;
Yan, Changfeng
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浏览/下载:12/0
  |  
提交时间:2019/11/15
Polishing parameters
wafer patterns
chemical mechanical polishing (CMP)
linear system
contact pressure
Effects of polishing parameters on evolution of different wafer patterns during Cu CMP
期刊论文
IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116
作者:
Wu, Lixiao
;
Yan, Changfeng
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浏览/下载:0/0
  |  
提交时间:2020/11/14
Copper
Elastic moduli
Erosion
Linear systems
Polishing
Topography
Chemical mechanical polishing(CMP)
Contact pressures
High selectivity
Polishing parameters
Polishing processs
Preston coefficients
Selectivity ratio
Wafer patterns
Preparation and dispersion of nanosize ceria in high electrolyte slurry by ball-milling
期刊论文
Integrated Ferroelectrics, 2015, 卷号: 161, 期号: 1, 页码: 36-44
作者:
He, Hanwei*
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浏览/下载:12/0
  |  
提交时间:2019/12/03
Ball milling
Ceria nanoparticle slurry
Chemical-mechanical polishing
Polymer-induced stabilization
Preparation of cobalt-doped colloidal silica abrasives and their chemical mechanical polishing performances on sapphire
期刊论文
MICRO & NANO LETTERS, 2015, 卷号: 10, 页码: 657-661
作者:
Ma, Pan[1]
;
Lei, Hong[2]
;
Chen, Ruling[3]
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浏览/下载:2/0
  |  
提交时间:2019/04/30
silicon compounds
cobalt
abrasives
time of flight mass spectra
secondary ion mass spectra
scanning electron microscopy
chemical mechanical polishing
surface roughness
atomic emission spectroscopy
X-ray photoelectron spectra
cobalt-doped colloidal silica abrasives
chemical mechanical polishing
seed-induced growth
time-of-flight secondary ion mass spectroscopy
scanning electron microscopy
CMP
sapphire substrates
surface roughness
material removal rate
inductively couple
A mixed elastohydrodynamic lubrication model for simulation of chemical mechanical polishing with double-layer structure of polishing pad
期刊论文
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2015, 卷号: 77, 页码: 107-116
作者:
Zhou, Ping
;
Dong, Zhigang
;
Kang, Renke
;
Jin, Zhuji
;
Guo, Dongming
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浏览/下载:5/0
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提交时间:2019/12/09
Chemical mechanical polishing
Elastohydrodynamic lubrication
Multi-layered elastic theory
Wafer
Material removal rate
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