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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 发表日期：2014    专题：大连理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 In situ study on growth behavior of interfacial bubbles and its size effect on Sn-0.7cu/Cu interfacial reaction 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Sun, Junhao;  Du, Yao;  Kunwar, Anil;  Qu, Lin;  Li, Shuang 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 bubbles  intermetallic compound  Interfacial reaction  Diffusion  Dissolution  Synchrotron radiation  SEM   A Numerical Model for Diffusion Driven Gas Bubble Growth in Molten Sn-based Solder 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Kunwar, Anil;  Ma, Haitao;  Sun, Junhao;  Qu, Lin;  Li, Shuang 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/09 Reliabilty  Single Bubble  Finite Element Method  Lagrangian Mesh Update  Axisymmetry  Diffusion Limited Region  Synchrotron Radiation  SEM  Interface   Reverse Polarity Effect in Cu/Sn-9Zn/Ni Interconnect under High Current Density at High Temperature 会议论文 15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12 作者:  Huang, Mingliang;  Zhang, Zhijie;  Zhao, Ning;  Feng, Xiaofei 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Liquid-solid electromigration (L-S EM)  Sn-9Zn solder  intermetallic compound (IMC)  reverse polarity effect  synchrotron radiation   In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction 期刊论文 SCRIPTA MATERIALIA, 2014, 卷号: 72-73, 页码: 43-46 作者:  Qu, L.;  Zhao, N.;  Zhao, H. J.;  Huang, M. L.;  Ma, H. T. 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 Soldering  Synchrotron radiation  Interfacial reaction  Intermetallic compounds  Kinetics   In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process 期刊论文 APPLIED SURFACE SCIENCE, 2014, 卷号: 305, 页码: 133-138 作者:  Qu, L.;  Ma, H. T.;  Zhao, H. J.;  Kunwar, Anil;  Zhao, N. 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Intermetallic compound  Interfacial reaction  Bubbles  Diffusion  Dissolution  Synchrotron radiation   Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 mu m Sn-Ag-Cu solder bumps 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 卷号: 602, 页码: 281-284 作者:  Huang, M. L.;  Yang, F.;  Zhao, N.;  Yang, Y. C. 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09 Intermetallics  Crystal growth  Synchrotron radiation  Ag3Sn  Undercooling  Precipitation   Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography 期刊论文 JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 卷号: 616, 页码: 550-555 作者:  Wang, Tongmin;  Cao, Fei;  Zhou, Peng;  Kang, Huijun;  Chen, Zongning 收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09 Interface diffusion  Crystal growth  Diffusion coefficient  Al/Cu bimetal  Synchrotron radiation