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Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography
Wang, Tongmin; Cao, Fei; Zhou, Peng; Kang, Huijun; Chen, Zongning; Fu, Yanan; Xiao, Tiqiao; Huang, Wanxia; Yuan, Qingxi
刊名JOURNAL OF ALLOYS AND COMPOUNDS
2014
卷号616页码:550-555
关键词Interface diffusion Crystal growth Diffusion coefficient Al/Cu bimetal Synchrotron radiation
ISSN号0925-8388
URL标识查看原文
内容类型期刊论文
URI标识http://www.corc.org.cn/handle/1471x/4428084
专题大连理工大学
作者单位1.Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Mat Modificat Laser Ion & Electron Beams, Minist Educ, Dalian 116024, Peoples R China.
2.Chinese Acad Sci, Shanghai Inst Appl Phys, Shanghai 201204, Peoples R China.
3.Chinese Acad Sci, Inst High Energy Phys, Beijing 100039, Peoples R China.
推荐引用方式
GB/T 7714
Wang, Tongmin,Cao, Fei,Zhou, Peng,et al. Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2014,616:550-555.
APA Wang, Tongmin.,Cao, Fei.,Zhou, Peng.,Kang, Huijun.,Chen, Zongning.,...&Yuan, Qingxi.(2014).Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography.JOURNAL OF ALLOYS AND COMPOUNDS,616,550-555.
MLA Wang, Tongmin,et al."Study on diffusion behavior and microstructural evolution of Al/Cu bimetal interface by synchrotron X-ray radiography".JOURNAL OF ALLOYS AND COMPOUNDS 616(2014):550-555.
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