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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：中国石油大学（北京）    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 The Preparation of SiO2@BN/epoxy composites with high thermal conductivity and excellent thermo-mechanical property 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA 作者:  Gao, Yuan;  Zhu, Pengli;  Li, Gang;  Sun, Rong;  Wong, Chingping 收藏  |  浏览/下载：4/0  |  提交时间：2020/01/03 SiO2@BN hybrids  core-shell structure  high thermal conductivity  excellent thermo-mechanical properties   Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA 作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Gao, Yuan;  Sun, Rong 收藏  |  浏览/下载：4/0  |  提交时间：2020/01/03 SiO2@Ag hybrid particles  conductive adhesive  sintered  thermal expansion coefficient   Liquid Epoxy Molding Compound with High Glass Transition Temperature and High Thermal Conductivity 会议论文 18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA 作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Li, Gang;  Sun, Rong 收藏  |  浏览/下载：6/0  |  提交时间：2020/01/03 Fan-out Wafer Level Package  EMC  Thermal conductivity  Glass transition temperature   Synthesis and characterization of silica-silver core-shell structural spheres and its application in conductive adhesive 会议论文 18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16 作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Gao, Yuan;  Sun, Rong 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/03 Liquid epoxy molding compound with high glass transition temperature and high thermal conductivity 会议论文 18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16 作者:  Li, Jinze;  Zhang, Baotan;  Zhu, Pengli;  Li, Gang;  Sun, Rong 收藏  |  浏览/下载：4/0  |  提交时间：2020/01/03 The Preparation of SiO2@BN/epoxy composites with high thermal conductivity and excellent thermomechanical property 会议论文 18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16 作者:  Gao, Yuan;  Zhu, Pengli;  Li, Gang;  Sun, Rong;  Wong, Chingping 收藏  |  浏览/下载：5/0  |  提交时间：2020/01/03 SILVER FLAKES FILLED INTERPENETRATING POLYMER NETWORK : HIGH PERFORMANCE ELECTRICALLY CONDUCTIVE ADHESIVES FOR ELECTRONIC PACKAGING 会议论文 China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA 作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Huang, Shulei;  Sun, Rong 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/03 CURE KINETICS STUDY OF A NOVEL DIE ATTACH ADHESIVE FOR HIGH POWER LIGHT-EMITTING DIODE 会议论文 China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA 作者:  Zhang, Baotan;  Sun, Rong;  Han, Yankang;  Zhu, Pengli;  Lu, Daoqiang 收藏  |  浏览/下载：7/0  |  提交时间：2020/01/03 Preparation of highly conductive adhesives by in-stiu incorporation of silver nanoparticles 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA 作者:  Han, Yankang;  Zhang, Baotan;  Zhu, Pengli;  Liu, Qianqian;  Hu, Yougen 收藏  |  浏览/下载：7/0  |  提交时间：2020/01/03 Ag nano-particles  Isotropic electrically conductive adhesive  volume resistivity  shear strength