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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Packaging issues on combination of LED and flip chip 会议论文 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005-06-27 作者:  Kun, Zhao[1];  Shiwei, Ma.[2];  Shihu, Su[3];  Jianhua, Zhang[4] 收藏  |  浏览/下载：11/0  |  提交时间：2019/05/10 Packaging issues on combination of LED and flip chip 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Zhao, Kun[1];  Ma, Shiwei[2];  Su, Shihu[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：5/0  |  提交时间：2019/05/10 Packaging issues on combination of LED and flip chip 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Zhao, Kun[1];  Ma, Shiwei[2];  Su, Shihu[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Packaging issues on combination of LED and flip chip 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Zhao, Kun[1];  Ma, Shiwei[2];  Su, Shihu[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10 Packaging issues on combination of LED and flip chip 会议论文 Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05) 作者:  Zhao, Kun[1];  Ma, Shiwei[2];  Su, Shihu[3];  Zhang, Jianhua[4] 收藏  |  浏览/下载：3/0  |  提交时间：2019/05/10