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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 专题：上海大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Tailoring the Thermal and Mechanical Properties of Graphene Film by Structural Engineering 期刊论文 SMALL, 2018, 卷号: 14, 页码: e1801346 作者:  Wang, Nan[1];  Samani, Majid Kabiri[2];  Li, Hu[3];  Dong, Lan[4];  Zhang, Zhongwei[5] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/22 grain size  graphene films  phonon transfer  thermal conductivity  turbostratic-stacking   Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5] 收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24 Graphene protection barrier  Cu-Plated PCB  Reliability   Effect of sintering method on properties of nanosilver paste 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Zhang, Qiaoran[1];  Liu, Jiawen[2];  Ke, Wei[3];  Huang, Shirong[4];  Latorre, Marti Gutierrez[5] 收藏  |  浏览/下载：16/0  |  提交时间：2019/04/24 nanosilver  sintering  thermal conductivity  shear strength   Graphene-based Heat Spreading Materials for Electronics Packaging Applications 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yuan, Guangjie[1];  Shan, Bo[2];  Chen, Shujing[3];  Yang, Yiqun[4];  Bao, Jie[5] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/24 heat spreading materials  graphene-based film  graphene-based electrically conductive adhesive  electronics packaging   Heat Dissipation Performance of Graphene Enhanced Electrically Conductive Adhesive for Electronic Packaging 会议论文 2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01 作者:  Yang, Yiqun[1];  Ye, Hui[2];  Ke, Wei[3];  Huang, Shirong[4];  Wang, Nan[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/24 heat dissipation  silver coated graphene  electrically conductive adhesive   Post-Growth Processing of Carbon Nanotubes for Interconnect Applications - A Review 会议论文 6th Electronic System-Integration Technology Conference (ESTC) 作者:  Fu, Yifeng[1];  Mu, Wei[2];  Sun, Shuangxi[3];  Wang, Ning[4];  Huang, Shirong[5] 收藏  |  浏览/下载：22/0  |  提交时间：2019/04/26 2D HEAT DISSIPATION MATERIALS FOR MICROELECTRONICS COOLING APPLICATIONS 会议论文 China Semiconductor Technology International Conference (CSTIC), 2016-01-01 作者:  Zhang, Yong[1];  Huang, Shirong[2];  Wang, Nan[3];  Bao, Jie[4];  Sun, Shuangxi[5] 收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26 Infrared Emissivity Measurement for Vertically Aligned Multiwall Carbon Nanotubes (CNTs) Based Heat Spreader Applied in High Power Electronics Packaging 会议论文 6th Electronic System-Integration Technology Conference (ESTC), 2016-09-13 作者:  Huang, Shirong[1];  Wang, Ning[2];  Bao, Jie[3];  Ye, Hui[4];  Zhang, Dongsheng[5] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26 vertically aligned multiwall carbon nanotubes  electronic packaging  infrared emissivity characterization  homogeneous sparseness   Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives 会议论文 6th Electronic System-Integration Technology Conference (ESTC), 2016-09-13 作者:  Wang, Nan[1];  Logothetis, Nikolaos[2];  Wei, Mu[3];  Huang, Shirong[4];  Ye, Lilei[5] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26 The Effects of Graphene-Based Films as Heat Spreaders for Thermal Management in Electronic Packaging 会议论文 17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16 作者:  Huang, Shirong[1];  Bao, Jie[2];  Ye, Hui[3];  Wang, Ning[4];  Yuan, Guangjie[5] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/26 Graphene-based film  Thermal performance  Finite element analysis  Electronic packaging